公开(公告)号：DE69103436D1

公开(公告)日：1994-09-22

申请号：DE69103436

申请日：1991-01-22

Applicant: IBM

Inventor： BERNARDO HERNANDEZ ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON

IPC: H01L21/60 ,  B23K20/02 ,  F28F9/20 ,  F28F13/00

Abstract: A high efficiency thermal interposer (150) comprising a first hollow disk (160) and second hollow disk (161), held together by thermally isolating fasteners (162, 163). The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (185) (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means (135) for introducing cold jets of air into the cavity containing the particles, means for circulating (169) the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.

公开(公告)号：DE69103436T2

公开(公告)日：1995-03-30

申请号：DE69103436

申请日：1991-01-22

Applicant: IBM

Inventor： BERNARDO HERNANDEZ ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON

IPC: H01L21/60 ,  B23K20/02 ,  F28F9/20 ,  F28F13/00

Abstract: A high efficiency thermal interposer (150) comprising a first hollow disk (160) and second hollow disk (161), held together by thermally isolating fasteners (162, 163). The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (185) (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means (135) for introducing cold jets of air into the cavity containing the particles, means for circulating (169) the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.