公开(公告)号：DE69300229D1

公开(公告)日：1995-08-10

申请号：DE69300229

申请日：1993-02-08

Applicant: IBM

Inventor： HERNANDEZ BERNARDO ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON ,  RITTER MARK B

IPC: H01L21/60 ,  B08B3/02 ,  B23K1/018 ,  B26F3/00 ,  H05K13/04

Abstract: A method and apparatus for removing wires bonded between chip contact pads (60) and substrate contact pads (10) using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

公开(公告)号：DE69013643T2

公开(公告)日：1995-05-04

申请号：DE69013643

申请日：1990-08-03

Applicant: IBM

Inventor： BREGMAN MARK FIELDING ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON

IPC: H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced.

公开(公告)号：DE69013643D1

公开(公告)日：1994-12-01

申请号：DE69013643

申请日：1990-08-03

Applicant: IBM

Inventor： BREGMAN MARK FIELDING ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON

IPC: H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates (101-107), each having at least one semiconductor electronic device (150, 151) mounted thereon; means (135, 136) for physically joining at least a subset of said plurality substrates to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and means (175, 176) for providing cooling channels (190, 191) within said enclosure into which a cooling fluid may be introduced.

公开(公告)号：DE69103436D1

公开(公告)日：1994-09-22

申请号：DE69103436

申请日：1991-01-22

Applicant: IBM

Inventor： BERNARDO HERNANDEZ ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON

IPC: H01L21/60 ,  B23K20/02 ,  F28F9/20 ,  F28F13/00

Abstract: A high efficiency thermal interposer (150) comprising a first hollow disk (160) and second hollow disk (161), held together by thermally isolating fasteners (162, 163). The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (185) (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means (135) for introducing cold jets of air into the cavity containing the particles, means for circulating (169) the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.

公开(公告)号：DE69300229T2

公开(公告)日：1996-02-29

申请号：DE69300229

申请日：1993-02-08

Applicant: IBM

Inventor： HERNANDEZ BERNARDO ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON ,  RITTER MARK B

IPC: H01L21/60 ,  B08B3/02 ,  B23K1/018 ,  B26F3/00 ,  H05K13/04

Abstract: A method and apparatus for removing wires bonded between chip contact pads (60) and substrate contact pads (10) using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.

公开(公告)号：DE69103436T2

公开(公告)日：1995-03-30

申请号：DE69103436

申请日：1991-01-22

Applicant: IBM

Inventor： BERNARDO HERNANDEZ ,  HORTON RAYMOND ROBERT ,  NOYAN ISMAIL CEVDET ,  PALMER MICHAEL JON

IPC: H01L21/60 ,  B23K20/02 ,  F28F9/20 ,  F28F13/00

Abstract: A high efficiency thermal interposer (150) comprising a first hollow disk (160) and second hollow disk (161), held together by thermally isolating fasteners (162, 163). The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (185) (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means (135) for introducing cold jets of air into the cavity containing the particles, means for circulating (169) the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.