公开(公告)号：JP2000294927A

公开(公告)日：2000-10-20

申请号：JP2000092241

申请日：2000-03-29

Applicant: IBM

Inventor： BERND K APPELT ,  JOHN M LAUFER ,  VOYA R MARKOVICH ,  MEMIS IRVING ,  DAVID J RUSSELL

IPC: H05K3/28 ,  H05K3/00 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method, in which a multilayer circuit board is formed on a board which comprises a first-level circuit pattern on at least one face. SOLUTION: This manufacturing method for a circuit board comprises a process 80, in which a dielectric capable of permanent imaging is formed as to cover a first-level circuit pattern. The manufacturing method contains a process 82, in which the dielectric capable of permanent imaging is exposed to radiation, process 84 in which a conductive metal layer is laminated on the dielectric, a process 86 in which a hole is formed in the conductive metal layer and the dielectric by a laser, a plasma ablation operation or a mechanical drilling operation, a process 8 in which a second-level circuit pattern is formed in which the hole is filled with a conductive material and in which the first-level circuit pattern and the second-level circuit pattern are connected electrically.