公开(公告)号：JP2010251741A

公开(公告)日：2010-11-04

申请号：JP2010074774

申请日：2010-03-29

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： ARVIN CHARLES L ,  SEMKOW KRYSTYNA WALERIA ,  BEZAMA RASCHID JOSE ,  SULLIVAN TIMOTHY DOOLING ,  COX HARRY DAVID ,  DAUBENSPECK TIMOTHY HARRISON

IPC: H01L21/60

CPC classification number: H01L24/05 ,  C25D5/02 ,  C25D5/14 ,  C25D5/48 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05075 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/013 ,  H01L2924/01027

Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable copper structure for improving current carrying capabilities (e.g., current spreading) of an interconnect, and to provide a method of fabricating the same. SOLUTION: The interconnect structure provides a highly reliable copper interconnect structure for improving current carrying capabilities (e.g., current spreading). The structure includes an under bump metallurgy formed in a trench. The under bump metallurgy includes at least: one adhesion layer; one plated barrier layer; and one plated conductive metal layer provided between the adhesion layer and the plated barrier layer. The structure further includes a solder bump formed on the under bump metallurgy. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供用于改善互连的载流能力（例如电流扩展）的高可靠性铜结构，并提供其制造方法。 解决方案：互连结构提供了高可靠性的铜互连结构，用于改善载流能力（例如电流扩展）。 该结构包括在沟槽中形成的凸块下金属。 凸块下冶金至少包括：一个粘合层; 一个电镀屏障层; 以及设置在粘合层和镀层阻挡层之间的一个镀覆的导电金属层。 该结构还包括形成在凸块下金属上的焊料凸块。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：DE3775827D1

公开(公告)日：1992-02-20

申请号：DE3775827

申请日：1987-05-12

Applicant: IBM

Inventor： BEZAMA RASCHID JOSE ,  PERRY CHARLES HAMPTON

IPC: B28B3/00 ,  B28B11/00 ,  B30B1/00 ,  B30B5/02 ,  C04B35/64 ,  F27B17/00

Abstract: A gas-loaded diaphragm (10) for exerting a predetermined pressure on a ceramic substrate during sintering to prevent x-y shrinkage. In the most preferred embodiment, the diaphragm comprises a gas-filled base composed of two opposing discs, and a substantially hollow gas-filled toroid container (20) disposed around the perimeter of the opposing discs and communicating therewith to permit gas flow therebetween. This diaphragm (10) is disposed in relation to a ceramic substrate-containing cell (28) so that when it is heated to a desired temperature, the gas in the diaphragm expands and forces the two opposing discs (12) apart to thereby exert a predetermined pressure on the ceramic substrate-containing cell (28).