公开(公告)号：DE2817269A1

公开(公告)日：1978-11-02

申请号：DE2817269

申请日：1978-04-20

Applicant: IBM

Inventor： AGARD RICHARD LYNN ,  BOCINSKI TERRENCE EDWARD ,  BREARLEY LAWRENCE EDGAR ,  YAPLE WILLIAM RILEY

IPC: H05K7/02 ,  H05K7/14 ,  H05K7/18 ,  H05K13/00

公开(公告)号：GB1282394A

公开(公告)日：1972-07-19

申请号：GB2257671

申请日：1971-04-19

Applicant: IBM

Inventor： BREARLEY LAWRENCE EDGAR ,  JENSEN STANLEY MYRON ,  SUBIK VINCENT PAUL ,  WILLIAMS GORDON LEROY

IPC: H01R12/55 ,  H05K1/14 ,  H05K3/36 ,  H05K7/10 ,  H05K7/14

Abstract: 1282394 Electric couplings INTERNATIONAL BUSINESS MACHINES CORP 19 April 1971 [2 March 1970] 22576/71 Heading H2E [Also in Division H1] A printed circuit assembly of the type used in data processing systems comprises a printed circuit base board 12 provided with conductors 14, an elastomeric pad 17 overlying a rigid member 16 attached to the board 12 and provided with contact lands on the pad 17 which make contact to selected conductor 14 on the board 12 and a printed circuit card or module 10 provided with contact areas which are held in contact with the contact lands by clamping means. The rigid member comprises a steel lattice framework which is attached to the board 12 with epoxy resin. The contact lands and connections to the conductors 14 comprise a thin film of polyimide material such as Kapton (Registered Trade Mark) with a ground copper plane on one side and a circuit pattern of etched of plated copper on the other side wrapped around and epoxied to the member 16 and pad 17. Through-connections may be provided for connecting the ground plane to the ground lines in the circuit pattern. The circuit pattern is soldered to the conductors 14. Each module may be a substrate of dielectric material such as ceramic or epoxy glass and provided with through-connections for connecting chips to the contact areas.