公开(公告)号：DE3176104D1

公开(公告)日：1987-05-14

申请号：DE3176104

申请日：1981-10-27

Applicant: IBM

Inventor： HOUSER DAVID ERLE ,  KOHN HAROLD ,  WILLIAMS GORDON LEROY

IPC: B23P21/00 ,  B23P19/02 ,  H01L23/50 ,  H05K13/04

Abstract: The pinner apparatus affixes multiple pins (P) in the holes (H) of a ceramic substrate (5) by simultaneously impacting the pins with a piston assembly (11) which temporarily places the pins in a viscoelastic fluid state. This leaves each pin with an extension that interlocks with the ceramic substrate. … The piston assembly is driven by a pneumatic high pressure system (48) which is adjustable to the number of pins being simultaneously impacted. Release of the piston assembly is delayed until the air pressure becomes stabilized prior to impact. A vacuum system (68) returns the piston to its originating position after impact whereupon the piston assembly is ready for the next impact cycle. A shuttle valve assembly (33) selectively connects the high pressure or the vacuum system to the chamber (21) in which the piston assembly is movable.

公开(公告)号：GB1282394A

公开(公告)日：1972-07-19

申请号：GB2257671

申请日：1971-04-19

Applicant: IBM

Inventor： BREARLEY LAWRENCE EDGAR ,  JENSEN STANLEY MYRON ,  SUBIK VINCENT PAUL ,  WILLIAMS GORDON LEROY

IPC: H01R12/55 ,  H05K1/14 ,  H05K3/36 ,  H05K7/10 ,  H05K7/14

Abstract: 1282394 Electric couplings INTERNATIONAL BUSINESS MACHINES CORP 19 April 1971 [2 March 1970] 22576/71 Heading H2E [Also in Division H1] A printed circuit assembly of the type used in data processing systems comprises a printed circuit base board 12 provided with conductors 14, an elastomeric pad 17 overlying a rigid member 16 attached to the board 12 and provided with contact lands on the pad 17 which make contact to selected conductor 14 on the board 12 and a printed circuit card or module 10 provided with contact areas which are held in contact with the contact lands by clamping means. The rigid member comprises a steel lattice framework which is attached to the board 12 with epoxy resin. The contact lands and connections to the conductors 14 comprise a thin film of polyimide material such as Kapton (Registered Trade Mark) with a ground copper plane on one side and a circuit pattern of etched of plated copper on the other side wrapped around and epoxied to the member 16 and pad 17. Through-connections may be provided for connecting the ground plane to the ground lines in the circuit pattern. The circuit pattern is soldered to the conductors 14. Each module may be a substrate of dielectric material such as ceramic or epoxy glass and provided with through-connections for connecting chips to the contact areas.