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公开(公告)号:US3304527A
公开(公告)日:1967-02-14
申请号:US45070465
申请日:1965-04-26
Applicant: IBM
Inventor: MARRS RALPH E , BREDE DWIGHT W
IPC: B23Q3/154 , G11B17/028
CPC classification number: G11B17/0287 , B23Q3/1546
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公开(公告)号:US3610837A
公开(公告)日:1971-10-05
申请号:US3610837D
申请日:1969-01-27
Applicant: IBM
Inventor: BREDE DWIGHT W , COOK MILES H , FREEMAN MARSHALL E , TURK HAROLD L
CPC classification number: G11B5/105 , G11B5/1335 , G11B5/1871 , G11B5/6005
Abstract: An air bearing slider assembly includes a three-piece ceramic body held together by glass bonds and a magnetic head rigidly mounted by glass within a slot in the body and presenting a nonmagnetic gap at an air bearing surface of the body to facilitate noncontact magnetic recording. The body of the slider assembly is made by separately molding the three ceramic pieces, finishing the surfaces on one of the pieces which later support the magnetic head, and heating glass frit between surfaces of the pieces to a fluid to bond them together. Completion of the slider assembly is then accomplished by positioning the head against the supporting surfaces and within a slot in the formed body, filling the slot with a fluid glass composition to bond the head to the body, and finishing an air bearing surface of the body and included nonmagnetic gap of the head.
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公开(公告)号:CA906642A
公开(公告)日:1972-08-01
申请号:CA906642D
Applicant: IBM
Inventor: TURK HAROLD L , BREDE DWIGHT W , FREEMAN MARSHALL E , COOK MILES H
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公开(公告)号:CA782072A
公开(公告)日:1968-04-02
申请号:CA782072D
Applicant: IBM
Inventor: BREDE DWIGHT W , MARRS RALPH E
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公开(公告)号:DE3778290D1
公开(公告)日:1992-05-21
申请号:DE3778290
申请日:1987-10-06
Applicant: IBM
Inventor: AINSLIE NORMAN G , BREDE DWIGHT W , ERPELDING A DAVID , PATTANAIK SURYA
Abstract: In a data recording disk file a slider (16) is mechanically attached to the suspension (40) by means of reflowed solder balls (80). A pattern of solder contact pads (70) is formed on the back side of the slider and a similar pattern of solder-wettable regions (60,61,63) is formed on the suspension. Solder balls are formed on either the solder contact pads or the solder-wettable regions, the slider is located on the suspension so that the solder balls are in registration between the solder contact pads and solder-wettable regions, and the solder is heated to reflow, thereby forming solder joints (80,86) as a mechanical connection between the slider and suspension. When a thin film transducer (11,13) is formed on the slider trailing edge (26) and the suspension is a laminated type with patterned conductors (46,55), solder balls are also formed on the transducer lead terminations (19,21; 27,29) on the trailing edge and on a row of solder-wettable regions (61,63) on the suspension near the location where the trailing edge of the slider is to be located. In this embodiment, when the slider with thin film transducer, with solder balls on the lead terminations, is located over the suspension then all of the solder balls are heated. The solder balls for providing mechanical connection collapse during reflow, thereby causing the solder balls on the transducer lead terminations to come in contact with and flow together with the solder balls formed on the row of solder-wettable regions on the suspension. Thus the mechanical attachment of the slider is made simultaneously with the electrical connection of the transducer leads to the disk file read/write electronics.
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