-
公开(公告)号：JPH103634A
公开(公告)日：1998-01-06
申请号：JP6271597
申请日：1997-03-17
Applicant: IBM
Inventor： ERPELDING A DAVID , PALMER DARRELL DEAN , PATTANAIK SURYA , RUIZ OSCAR JAIME
Abstract: PROBLEM TO BE SOLVED: To bear fragility, a weak impact property, etc., and to prevent strain due to compression force by providing a slider suspension assembly having a laminated load beam attaching a reinforcement member. SOLUTION: This magnetic disk data storage system contains the slider suspension assembly used for a slider 30 of a pico-size and a nano-size for a data disk file. This assembly contains the laminated load beam 20 provided with plural layers and applied so as to attach the slider 30 to one end of a side opposite to a file actuator support part. This laminated load beam 20 is provided with at least a conductor, and is provided with an electric lead wire for connecting to the slider 30. The reinforcement member 13 reinforcing the assembly is attached to the laminated load beam 20. This reinforcement member 13 is formed to a required shape by a stamping process.
-
公开(公告)号：JPH11120715A
公开(公告)日：1999-04-30
申请号：JP22771698
申请日：1998-08-12
Applicant: IBM
Inventor： ARYA SATYA PRAKASH , ERPELDING A DAVID , PALMER DARRELL DEAN , PATTANAIK SURYA
Abstract: PROBLEM TO BE SOLVED: To provide the method for soldering a suspension and a lead of a converter of a miniaturized disk drive. SOLUTION: The suspension member 32 is provided with the integrated electrically conductive lead 120 extending to the rear tail part along the longitudinal direction. This lead 120 is extended beyond the tail part and electrically connected with an acceptor pad member. The distant end 135 of the lead is provided with a recessed area at the edge of a terminal for guiding the flow of the fluid solder to the joint part. This recessed area is formed into e.g. a chamfer 136, preferably to be semicircular. The tail pad is provided with a pair of tab members 134 accepted by an opening part of the acceptor pad member, for accurately aligning the lead.
-
3.发明专利
公开(公告)号：JPH1055511A
公开(公告)日：1998-02-24
申请号：JP9909197
申请日：1997-04-16
Applicant: IBM
Inventor： ERPELDING A DAVID , PATTANAIK SURYA , SIMMONS RANDALL GEORGE
Abstract: PROBLEM TO BE SOLVED: To protect an MR head having an MR sensor against the damage generated by the presence of an electric field having static electricity by discharge. SOLUTION: The MR head is provided with shunts in the positions immediate near the terminals of adjacent conductive leads 18, 19 heading toward the MR sensor on the MR head across these leads. Solder overhanging parts of at least one of selected shapes are arranged adjacently to the leads in order to facilitate the removal of the shunts by causing the reflow of solder. These overhanging parts include limitation overhanging parts 30, 32 which play the role of limiting the solder within the shunt regions when the shunts are formed and an assignment part 32 which acts to transfer the solder from the shunt regions to an assigned position at the time of the next reflow of the solder and to give rise to physical breakdown in the shunt accordingly. The need for the physical removal of the solder material is eliminated.
-
公开(公告)号：JPH103633A
公开(公告)日：1998-01-06
申请号：JP5367097
申请日：1997-03-07
Applicant: IBM
Inventor： FRATER NORMAN KERMIT , PATTANAIK SURYA , RUIZ OSCAR JAIME , SHUM WING C
Abstract: PROBLEM TO BE SOLVED: To control strictly spacing between a slider and a suspension. SOLUTION: A slider/suspension assembly is constituted so as to provide a spacer device separating the slider 56 from the suspension 42 as for a data recording disk file. In such a case, this spacer device contains one or above of solder bumps 66, and their heights are controlled strictly, and the required spacing is given. This spacing device prevents the contact between the slider 56 and the suspension 42.
-
公开(公告)号：DE69518110T2
公开(公告)日：2001-03-01
申请号：DE69518110
申请日：1995-05-16
Applicant: IBM
Inventor： PATTANAIK SURYA
Abstract: A method for the fabrication of a data recording disk file slider-suspension assembly, the slider being of the type having an air bearing surface, a back side opposite the air bearing surface and a trailing edge having a read or write transducer formed as a thin film thereon with electrical leads formed solely on the trailing edge and terminating adjacent the slider back side at termination pads, and a suspension having etched conductive lead structures and conductive contact pads connected to the lead structures. The method comprising the steps of forming a solder bump on each of the termination pads and each of the contact pads, wherein one or more solder bumps are selectively flattened, mechanically attaching the back side of the slider to the suspension such that the termination pads are properly aligned with the contact pads, and heating the solder bumps so as to reflow the termination pad and contact pad bumps such that they electrically connect, wherein a selectively flattened bump extends along an axis defined by a point on one pad and a point on another pad when heated to make contact with another bump.
-
Patent Agency Ranking
公开(公告)号：DE69606201T2
公开(公告)日：2000-07-06
申请号：DE69606201
申请日：1996-06-19
Applicant: IBM
Inventor： FRATER KERMIT , PATTANAIK SURYA , RUIZ JAIME , SHUM C
Abstract: Disc file data read/write head assembly has a slider (56) having an air bearing surface facing the data surface of the disc and a back surface which is attached to a suspension (42) which biases the slider in close proximity to the disc surface, in which the spacing between the slider (56) and suspension (42) is maintained by at least one solder bump (66). Also claimed is the method of controlling the spacing between the suspension and slider as described above and in which the slider is attached to the suspension by adhesive surrounding the solder bumps, and such a slider suspension arrangement in a magnetic disc data storage system.
-
公开(公告)号：DE69700839T2
公开(公告)日：2000-05-25
申请号：DE69700839
申请日：1997-02-24
Applicant: IBM
Inventor： ERPELDING DAVID , PATTANAIK SURYA , SIMMONS RANDALL
Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.
-
公开(公告)号：DE69700839D1
公开(公告)日：1999-12-30
申请号：DE69700839
申请日：1997-02-24
Applicant: IBM
Inventor： ERPELDING DAVID , PATTANAIK SURYA , SIMMONS RANDALL
Abstract: MR heads having MR sensors are protected against damage caused by electrostatic discharge or the presence of electrostatically charged fields. A shunt is provided across the adjacent conductive leads or traces to the MR sensor at a point that is immediately adjacent their termination on the MR head. A solder bridge may be used for the shunt. The solder shunt is removed prior to putting the integrated suspension on which the MR head is mounted into operation in a magnetic disk drive system. The solder shunt is removed by reflowing the solder and drawing the reflowed solder away from the leads to break electrical connection of the shunt across the adjacent leads to the MR sensor. To facilitate removing the shunt by reflowing the solder, at least one solder lobe of a chosen geometry is placed adjacent a lead. This lobe includes a confining lobe which serves to confine the solder in the shunt region when the shunt is formed, and a designated portion which serves to draw the solder to a designated location away from the shunt region upon subsequent solder reflow, thereby causing a physical break in the shunt. Physical removal of the solder material would not be required. The shunt may also be in the form of an integral bridge of conductive material interconnecting the adjacent leads, which is removed by using a laser to melt the material.
-
公开(公告)号：GB2295918B
公开(公告)日：1998-10-21
申请号：GB9524956
申请日：1995-12-06
Applicant: IBM
Inventor： ERPELDING A DAVID , PALMER DARREL D , RUIZ OSCAR J , PATTANAIK SURYA
Abstract: A suspension system for supporting a magnetic read/write slider comprises a load beam, a slider support member and a flexure comprised of a first flexure arm and a second flexure arm. The electrical conductors to the slider are positioned either along one or both flexure arms or adjacent to, but outside of, the second flexure arm, so as not to contribute to the stiffness of the second flexure arm. The electrical conductors are comprised of a laminated material which includes a conductor layer, such as a high strength copper alloy, a dielectric layer and a support layer. A first plurality of slots extend completely through the first flexible finger region, and a second plurality of slots extend completely through the second flexible finger region for providing regions into which the electrical conductors can move when the flexure undergoes deflections (see fig 12).
-
公开(公告)号：SG30325A1
公开(公告)日：1996-06-01
申请号：SG1995000163
申请日：1995-03-25
Applicant: IBM
Inventor： PATTANAIK SURYA
IPC: G11B21/21
-
-
-
-
-
-
-
-
-
Search Results
25
records
(took 0.01 seconds)
