公开(公告)号：SG96261A1

公开(公告)日：2003-05-23

申请号：SG200107065

申请日：2001-11-13

Applicant: IBM

Inventor： KEVIN PETRARCA ,  ROBERT A GROVES ,  BRIAN HERBST ,  CHRISTOPHER JAHNES ,  RICHARD VOLANT

IPC: B81B3/00 ,  H01H59/00 ,  H01P1/10

Abstract: A micro electromechanical switch has a guidepost formed upon a substrate. A signal transmission line is formed on the substrate, with the signal transmission line having a gap and forming an open circuit. The switch further includes a switch body having a via opening formed therein, with the switch body being movably disposed along an length defined by the guide post. The guidepost is partially surrounded by the via opening.