公开(公告)号：CA1225362A

公开(公告)日：1987-08-11

申请号：CA436856

申请日：1983-09-16

Applicant: IBM

Inventor： BLUM SAMUEL E ,  BROWN KAREN H ,  SRINIVASAN RANGASWAMY

IPC: C01B33/113 ,  B01J19/12 ,  C01B33/12 ,  C04B41/50 ,  C04B41/87 ,  H01L21/316 ,  C23C20/08

Abstract: PROCESS FOR DEPOSITING METALLIC COPPER Metallic copper is deposited on a substrate by a process which involves confining the vapor of a fluorinated organic copper compound in an enclosed chamber containing the substrate, and decomposing the copper compound by means of irradiation with light.