Abstract:
Ingots of high purity III-V semiconductor compositions are prepared by encapsulating the molten Group III element with a barrier material that is permeable to the vapors of the Group V element while being impermeable to contaminants inherent in the system such as silicon and the like. The synthesis of the composition may be carried out in a conventional vertical sealed quartz enclosure. A crucible containing the Group III element and a barrier material and the Group V element are disposed within the sealed enclosure. The barrier material acts as a permeable membrane for vapors of the Group V element and as an impermeable membrane, or getter, for contaminants inherent in the system. Thus, vapors of the Group V element is permitted to diffuse through the barrier layer to react with the molten Group III element to form the III-V composition to the exclusion of contaminants. Ingots of highly pure III-V compositions are prepared in this manner.
Abstract:
The disclosure presents a method of growing large crystals of GaP from solution in which a zone of liquid gallium saturated with GaP is passed upward through a GaP feed ingot. In order to grow large crystals, it was found necessary to initiate growth onto a twinned seed crystal in which all of the twin planes are parallel to each other and parallel to a growth direction. Wafers cut parallel to the twin planes exhibit a (111) surface which are suitable for electroluminescent devices.
Abstract:
A mixed crystal e.g., GaxIn1 xP, of controlled composition in the growth direction, either of substantially homogeneous composition or of variable composition, is prepared from the melt or liquid solution by the method of this disclosure. Illustratively, the starting materials are two different pure III-V compounds with different melting points, e.g., GaP and InP, which are to be the components from which the mixed crystal is to be grown. A three-layered composite or charge is fabricated consisting of a layer of the lower melting compound flanked on both top and bottom by layers of the higher melting compound. The composite is established in a crucible which is sealed in a quartz ampul in vacuum to form an assembly. When an overpressure of either an inert or a reactive gas is required, the quartz ampul is sealed inside a stronger container, e.g., of graphite. The assembly is allowed to equilibrate isothermally in a furnace of a given temperature to yield a liquid solution from which the desired solid solution of mixed crystal can crystallize. For crystal growth with homogeneous composition the assembly is lowered slowly into a slightly cooler temperature zone of the furnace and crystallization of the mixed crystal occurs at the lower one of the two liquid-solid interfaces. A single crystal is obtained by epitaxial growth when the substrate is a singlecrystal seed. As the liquid becomes depleted in the higher melting component at the growth interface, the dissolution of the higher melting component at the upper liquid-solid interface replenishes the composition of the liquid. This physical process is incrementally small, i.e., it occurs slowly, and results in the composition of the liquid remaining essentially in a steady state of constant composition. Illustratively, GaxIn1 xP cylindrical ingots of approximately 1 cm. length X 1.5 cm. diameter are readily produced from the components of GaP and InP by the practice of this disclosure.
Abstract:
GREEN-EMITTING ELECTROLUMINESCENT GALLIUM PHOSPHIDE DIODES ARE GROWN BY LIQUID PHASE EPITAXY. A GA-GAP MELT CONTAINED IN A COVERED CRUICIBLE IS PLACED IN A VERTICAL FURNACE. A GAP SUBSTRATE WAFER IS INSERTED INTO THE MELT WHICH HAS BEEN MAINTAINED AT A TEMPERATURE OF ABOUT 1110-1140*C. AN N-TYPE GAP LAYER IS PRODUCED BY THE ADDITION OF A DOPANT SELECTED FROM S, SE, AND TE TO THE MELT WHICH IS SLOWLY COOLED TO A TEMPERATURE OF ABOUT 1070-1100*C., AT WHICH TIME THE MELT IS COUNTERDOPED WITH AN ACCEPTOR DOPANT, E.G., ZN OR CD. THE MELT IS FURTHER COOLED TO ABOUT 1030-1060*C., CAUSING THE GROWTH OF A P-TYPE LAYER, AFTER WHICH THE SUBSTRATE IS REMOVED FROM THE METAL AND FURTHER COOLED TO AMBIENT TEMPERATURES. ELECTROLUMINESCENT DIODES ARE THEN PREPARED BY THINNING THE SUBSTRATE SIDE OF THE WAFER TO REDUCE SERIES RESISTANCE. AU-ZN AND AU-SN ALLOY DOTS ARE APPLIED TO THE P AND N SIDE RESPECTIVELY, OF SAWED OR CLEAVED SECTIONS OF THE WAFER. GREEN-EMITTING DIODES PREPARED BY THE ABOVE METHOD HAVE EFFICIENCIES OF ABOUT 2.7X10-4, WHICH EFFICIENCIES CAN BE IMPROVED BY A FACTOR OF 2 OR MORE BY COATING THE DIODES WITH ANTI-REFLECTIVE EPOXY COATINGS. THE DIODES FIND UTILITY AS PANEL INDICATORS.
Abstract:
MASKLESS METHOD FOR ELECTROLESS PLATING PATTERNS A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 103 to 104. This enhancement is sufficient to make masking unnecessary. YO979-021
Abstract:
YO982-087 FAR ULTRAVIOLET SURGICAL AND DENTAL PROCEDURES A method and apparatus are described for photoetching organic biological matter without requiring heat as the dominant etching mechanism. Farultraviolet radiation of wavelengths less than 200 nm are used to selectively remove organic biological material, where the radiation has an energy fluence sufficiently great to cause ablative photodecomposition. Either continuous wave or pulse radiation can be used, a suitable ultraviolet light source being an ArF excimer laser having an output at 193 nm. The exposed biological material is ablatively photodecomposed without heating or damage to the rest of the organic material. Medical and dental applications include the removal of damaged or unhealthy tissue from bone, removal of skin lesions, cutting or sectioning healthy tissue, and the treatment of decayed teeth.
Abstract:
PROCESS FOR DEPOSITING METALLIC COPPER Metallic copper is deposited on a substrate by a process which involves confining the vapor of a fluorinated organic copper compound in an enclosed chamber containing the substrate, and decomposing the copper compound by means of irradiation with light.