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公开(公告)号：GB2583624A
公开(公告)日：2020-11-04
申请号：GB202010481
申请日：2018-12-07
Applicant: IBM
Inventor： JOSEPH KUCZYNSKI , BRUCE CHAMBERLIN , MATTHEW KELLY , SCOTT KING
IPC: H05K3/46
Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.
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