公开(公告)号：GB2581756B

公开(公告)日：2021-01-20

申请号：GB202008846

申请日：2018-11-09

Applicant: IBM

Inventor： JACOB PORTER ,  JOSEPH KUCZYNSKI ,  JASON WERTZ ,  BRANDON KOBILKA

IPC: A61J1/20 ,  A61J1/14 ,  A61M5/00

Abstract: An apparatus, method, and article of manufacture for transferring fluid contained in a syringe. The apparatus includes an airlock component having a cylindrical body with a first end, a second end, and a hollow tube disposed between the first end and the second end. An annular opening is located at the first end of the cylindrical body. The hollow tube includes a gas inlet aperture and a gas outlet aperture. The hollow tube also includes an inwardly-facing airtight material coupled to the interior surface of the hollow tube, and a septum coupled to the second end of the cylindrical body. The method includes transferring fluid from one container to a second container using the apparatus. The article of manufacture includes the apparatus, a syringe, and a needle.

公开(公告)号：GB2581756A

公开(公告)日：2020-08-26

申请号：GB202008846

申请日：2018-11-09

Applicant: IBM

Inventor： JACOB PORTER ,  JOSEPH KUCZYNSKI ,  JASON WERTZ ,  BRANDON KOBILKA

IPC: A61J1/14 ,  A61J1/20 ,  A61M5/00

Abstract: An apparatus, method, and article of manufacture for transferring fluid contained in a syringe. The apparatus includes an airlock component having a cylindrical body with a first end, a second end, and a hollow tube disposed between the first end and the second end. An annular opening is located at the first end of the cylindrical body. The hollow tube includes a gas inlet aperture and a gas outlet aperture. The hollow tube also includes an inwardly-facing airtight material coupled to the interior surface of the hollow tube, and a septum coupled to the second end of the cylindrical body. The method includes transferring fluid from one container to a second container using the apparatus. The article of manufacture includes the apparatus, a syringe, and a needle.

公开(公告)号：GB2583624A

公开(公告)日：2020-11-04

申请号：GB202010481

申请日：2018-12-07

Applicant: IBM

Inventor： JOSEPH KUCZYNSKI ,  BRUCE CHAMBERLIN ,  MATTHEW KELLY ,  SCOTT KING

IPC: H05K3/46

Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

公开(公告)号：GB2498464B

公开(公告)日：2017-10-25

申请号：GB201302341

申请日：2011-06-30

Applicant: IBM

Inventor： ARVIND KUMAR SINHA ,  JOSEPH KUCZYNSKI ,  TIMOTHY TOFIL ,  KEVIN SPLITTSTOESSER

IPC: C01B32/21 ,  H01L23/373

Abstract: The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material.

公开(公告)号：GB2502216B

公开(公告)日：2019-11-27

申请号：GB201314185

申请日：2012-01-04

Applicant: IBM

Inventor： DYLAN JOSEPH BODAY ,  JOSEPH KUCZYNSKI ,  ROBERT MEYER III

IPC: H01L23/373 ,  C09K5/14 ,  H01L23/42 ,  H05K7/20

Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.

公开(公告)号：GB2490813B

公开(公告)日：2016-09-21

申请号：GB201210460

申请日：2011-02-28

Applicant: IBM

Inventor： DYLAN JOSEPH BODAY ,  JOSEPH KUCZYNSKI

IPC: D06M13/513 ,  C03C25/40 ,  D06M11/79 ,  D06M13/517 ,  D06M101/00