公开(公告)号：DE3163159D1

公开(公告)日：1984-05-24

申请号：DE3163159

申请日：1981-04-08

Applicant: IBM

Inventor： BRUHN PETER HENRY ,  WUSTRAU ROLF

IPC: B32B38/00 ,  B21D28/10 ,  B29C63/00 ,  B32B37/00 ,  B32B43/00 ,  H02K15/02

公开(公告)号：DE68918823T2

公开(公告)日：1995-04-27

申请号：DE68918823

申请日：1989-12-06

Applicant: IBM

Inventor： BRUHN PETER HENRY

IPC: H05K13/02 ,  H01L21/50 ,  H01L21/60 ,  H01L21/683 ,  H05K13/04 ,  H01L21/00

Abstract: Apparatus is described for excising and forming tape mounted electronic devices in an automated fashion so that as the tape bearing the components is fed past a punch and die set, each frame bearing an electronic component is precisely aligned and the electronic component has its leads simultaneously excised from the tape and formed in a predetermined configuration, in a self aligning zero clearance punch and die set, the device so excised being then transferred to a presentation area for pickup for subsequent assembly operations.

公开(公告)号：DE68918823D1

公开(公告)日：1994-11-17

申请号：DE68918823

申请日：1989-12-06

Applicant: IBM

Inventor： BRUHN PETER HENRY

IPC: H05K13/02 ,  H01L21/50 ,  H01L21/60 ,  H01L21/683 ,  H05K13/04 ,  H01L21/00

Abstract: Apparatus is described for excising and forming tape mounted electronic devices in an automated fashion so that as the tape bearing the components is fed past a punch and die set, each frame bearing an electronic component is precisely aligned and the electronic component has its leads simultaneously excised from the tape and formed in a predetermined configuration, in a self aligning zero clearance punch and die set, the device so excised being then transferred to a presentation area for pickup for subsequent assembly operations.