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公开(公告)号:JPH08307134A
公开(公告)日:1996-11-22
申请号:JP10309296
申请日:1996-04-25
Applicant: IBM
Inventor: FURANKU JIEI KANORA , UIRIAMU BARERU NANERII , SAIRA PONNAPATSURI , BURAIAN SUKOTSUTO OOKUREI , MODESUTO MAIKERU OPURISUKO
Abstract: PROBLEM TO BE SOLVED: To obtain a hybrid antenna which has a planar patch antenna fixed to the upper surface of an insulated planar substrate and is composed of a microstrip antenna and a reflector antenna. SOLUTION: A substrate 1 is coupled with a ground plane by means of one or a plurality of insulated coupling means so that an air gap 10 may be formed between the substrate 1 and ground plane. The outer conductor of a coaxial cable 13 which can be connected to a transmitter-receiver is coupled with the bottom face of the ground plane and the inner conductor of the cable 13 is coupled with a feeder pin 9. The pin 9 passes through the ground plane 2 and reaches the surface of a patch and fixed to the patch by soldering.