公开(公告)号：JPH0642498B2

公开(公告)日：1994-06-01

申请号：JP31657488

申请日：1988-12-16

Applicant: IBM

Inventor： ARUNABA GUPUTA ,  BURAIAN UOTSUSHIYUBAAN HAASUI

IPC: H01L21/60 ,  B23K26/03

Abstract: An optical process monitor primarily for use in laser wire bonding detects the reflectivity change of the wire (12) being bonded in order to provide feedback control of the high power laser (10) used for bonding the wire (12) to a pad (14). The beam of a low power laser (30) which is co-linear or combined with the high power laser beam is conducted to the bond site and reflected from the wire (12) during the bonding cycle. The change in reflectivity of the wire during the bonding cycle is detected from the reflected low power laser beam. A signal commensurate with the detected change of reflectivity is used to control the power or duration of the high power laser (10) during bonding.

公开(公告)号：JPH01241139A

公开(公告)日：1989-09-26

申请号：JP31657488

申请日：1988-12-16

Applicant: IBM

Inventor： ARUNABA GUPUTA ,  BURAIAN UOTSUSHIYUBAAN HAASUI

IPC: H01L21/60 ,  B23K26/03

Abstract: PURPOSE: To provide a reflectance monitor for performing feedback control in a laser wire bonder by monitoring variation in the reflectance of a wire and processing the reflectance through feedback control for a laser being used in laser wire bonding. CONSTITUTION: An Nd:YAG laser 10 is employed for bonding a wire 12 to a pad 14 on a substrate 16. The monitor comprises a laser means 30 emitting low output laser energy having linearity common to a high output laser energy beam 10 and being reflected on the wire 12 during the bonding operation, means 48 for detecting the reflected low output laser energy and delivering a reflection signal proportional to the detected level and means 92 for controlling the high output laser energy beam depending on the reflection signal. According to the arrangement, laser processing can be controlled during laser wire bonding by utilizing variation in the reflectance of the wire 12 to be bonded.