公开(公告)号：JPH01320224A

公开(公告)日：1989-12-26

申请号：JP9657489

申请日：1989-04-18

Applicant: IBM

Inventor： UIRIAMU JIYOSEFU KARAHAA ,  EDOWAADO OOGASUTO GIIIZU ,  ARUNABA GUPUTA ,  ROBAATO BENJIYAMIN REIBOITSU ,  YUUJIN JIEN EMU OOSARIBUAN ,  ROBAATO RII SANDOSUTOROOMU

IPC: C01G3/00 ,  C01B13/14 ,  C01G1/00 ,  C04B41/89 ,  C30B23/02 ,  C30B25/18 ,  C30B29/22 ,  H01B12/06 ,  H01B13/00 ,  H01L39/14 ,  H01L39/22 ,  H01L39/24 ,  H01P3/08

公开(公告)号：JPH03200333A

公开(公告)日：1991-09-02

申请号：JP6134290

申请日：1990-03-14

Applicant: IBM

Inventor： KIISU FUOURAA BETSUKUHAN ,  DEBUITSUDO KARORU CHIYARENAA ,  ARUNABA GUPUTA ,  JIYOSEFU MASHIYUU HAABUIRUCHIY ,  JIEEMUSU MAAKU RIAZU ,  JIEEMUSU ROBAATO ROIDO ,  DEBUITSUDO KURIFUOODO RONGU ,  HORATEIO KUINONESU ,  KURISHIYUNA SESUHAN ,  MORISU SHIYATSUZUKESU

IPC: B23K26/00 ,  H01L21/3205 ,  H01L21/82 ,  H01L23/52 ,  H01L23/525 ,  H05K3/22

Abstract: PURPOSE: To form an open circuit suitable for use in the line of a semiconductor chip by feeding a DC current to a conductor and heating a selected position to be open-circuited of the conductor. CONSTITUTION: A power supply 34 operates to feed a DC current I through probes 36, 38 and a conductor 28'. When the current I is flowing through the conductor 28', a laser 22 and a focusing mechanism 24 operate to focus laser energy 26 generally onto a region 46 thus elevating the temperature of a conductor thereat. A sensor 40 operates to monitor the resistance in the conductor 28'. Since a DC current I is employed along with local heating of the conductor 28' with laser energy 26, an open circuit is formed surely in the conductor in a relatively short time without substantially damaging the peripheral and underlying structure.

公开(公告)号：JPH04228284A

公开(公告)日：1992-08-18

申请号：JP4218391

申请日：1991-02-15

Applicant: IBM

Inventor： ARUNABA GUPUTA ,  BERUGASEMU HABA ,  BURAIAN UOTSUSHIYUBOON HATSUSH ,  RUBOMIIRU TARASU ROMANKIU

IPC: B23K26/00 ,  B23K26/12 ,  B23K26/18 ,  B23K26/36 ,  C04B41/91 ,  C23F4/02 ,  G11B5/31 ,  G11B5/60 ,  H01L21/302

Abstract: PURPOSE: To accomplish laser etching of a substrate in a liquid by laser induced sonic cavitation at the substrate surface. CONSTITUTION: The preferred substrate 28 is laser energy absorbing and has a finite melting temp. The preferred liquid 12 is an organic or inorganic inert liquid which does not chemically react with a substrate at room temp. The laser 22 is preferably a copper vapor laser, but a chopped beam cw argon ion laser or a YAG laser adjusted to a low power output sufficient to avoid the formation of a recast layer can also be used. The laser parameters are adjusted for causing the growth and collapse of bubbles at the substrate surface. The laser etching has particular application in the fabrication of rails in magnetic head sliders and dicing of Al2 O3 -TiC, TiC, SiC, Si/SiO2 , and laser energy absorbing metals and metal oxides.

公开(公告)号：JPH03151231A

公开(公告)日：1991-06-27

申请号：JP24135790

申请日：1990-09-13

Applicant: IBM

Inventor： ARUNABA GUPUTA

IPC: B32B9/00 ,  C01G1/00 ,  C01G3/00 ,  C04B35/45 ,  H01B12/02 ,  H01L39/12

Abstract: PURPOSE: To have transition temperatures and critical current densities which are high enough by forming a first layer of a first copper-oxide material and a second layer of a second copper-oxide perovskite material. CONSTITUTION: A multilayer structure 2 includes layers 6 of Nd1.83 CE0.17 CU4 ±y which appear as dark bands and alternating with the neodymium cerium copper oxide layers 6 are layers 8 of YBa2 Cu3 O7-δ which appears as light bands. Both of the neodymium cerium copper oxide layers 6 and the yttrium barium copper oxide layers 8 are individual copper-oxide planes in the two copper oxide perovskite materials. By using alternating layers of different copper-oxide perovskite materials having different superconductors, high current densities are achieved.

公开(公告)号：JPH0642498B2

公开(公告)日：1994-06-01

申请号：JP31657488

申请日：1988-12-16

Applicant: IBM

Inventor： ARUNABA GUPUTA ,  BURAIAN UOTSUSHIYUBAAN HAASUI

IPC: H01L21/60 ,  B23K26/03

Abstract: An optical process monitor primarily for use in laser wire bonding detects the reflectivity change of the wire (12) being bonded in order to provide feedback control of the high power laser (10) used for bonding the wire (12) to a pad (14). The beam of a low power laser (30) which is co-linear or combined with the high power laser beam is conducted to the bond site and reflected from the wire (12) during the bonding cycle. The change in reflectivity of the wire during the bonding cycle is detected from the reflected low power laser beam. A signal commensurate with the detected change of reflectivity is used to control the power or duration of the high power laser (10) during bonding.

公开(公告)号：JPH01241139A

公开(公告)日：1989-09-26

申请号：JP31657488

申请日：1988-12-16

Applicant: IBM

Inventor： ARUNABA GUPUTA ,  BURAIAN UOTSUSHIYUBAAN HAASUI

IPC: H01L21/60 ,  B23K26/03

Abstract: PURPOSE: To provide a reflectance monitor for performing feedback control in a laser wire bonder by monitoring variation in the reflectance of a wire and processing the reflectance through feedback control for a laser being used in laser wire bonding. CONSTITUTION: An Nd:YAG laser 10 is employed for bonding a wire 12 to a pad 14 on a substrate 16. The monitor comprises a laser means 30 emitting low output laser energy having linearity common to a high output laser energy beam 10 and being reflected on the wire 12 during the bonding operation, means 48 for detecting the reflected low output laser energy and delivering a reflection signal proportional to the detected level and means 92 for controlling the high output laser energy beam depending on the reflection signal. According to the arrangement, laser processing can be controlled during laser wire bonding by utilizing variation in the reflectance of the wire 12 to be bonded.