-
公开(公告)号：DE3377656D1
公开(公告)日：1988-09-15
申请号：DE3377656
申请日：1983-10-26
Applicant: IBM
Inventor： BURNS RICHARD WAYNE , MAHMOUD ISSA SAID
Abstract: A method for preparing aluminium substrates for plating Nickel and copper thereon. This method includes sensitizing the surface of the substrates in a solution of sncl2 and HCL and activating said surface in a solution containing Pdcl2 and HCL.
Search Results
1
records
(took 0.016 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
