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公开(公告)号：JPH0637442A
公开(公告)日：1994-02-10
申请号：JP10633793
申请日：1993-05-07
Applicant: IBM
Inventor： LEERSSEN ARTHUR LEROY , MACE EVERITT WILLIAM , MAHMOUD ISSA SAID , RANDOLPH CHARLES TAYLOR , REECE JOHN , SETTLE GASTON GENE , TRUONG PHONG THAI , VASAN SRINI VARADARAJAN
Abstract: PURPOSE: To realize soldering to a minute pitch land with no bridging generated by allowing a solder paste to be screened through a mask. CONSTITUTION: A resist 6 is processed so as to provide the same height as a copper land 4 on a substrate 2, so that a solder 30 is imprinted through a hole 22 of a mask 20 of an appropriate size, and with a platen 50 which absorbs the solder 30 and warps, a sufficient heat and pressure for re-flow of the solder 30 is applied. The hole 22 of the mask 20 is in mil units, so as to be at about a level obtained by multiplying the number of corresponding lands 4 by a pitch, and the heated platen 50 falls to contact to the solder 30 and remains there, until the solder 30 melts. Thus, the platen 50 such as not absorbing the solder 30 rises and a remaining flux and solder particles are removed. Thus, a specified amount of solder is accurately stuck to a minute pitch conducting line, for the realization of soldering to a minute pitch land.
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公开(公告)号：DE69431866T2
公开(公告)日：2003-08-28
申请号：DE69431866
申请日：1994-10-28
Applicant: IBM
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公开(公告)号：DE69434192D1
公开(公告)日：2005-01-20
申请号：DE69434192
申请日：1994-10-28
Applicant: IBM
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公开(公告)号：DE3883740T2
公开(公告)日：1994-04-14
申请号：DE3883740
申请日：1988-12-12
Applicant: IBM
Inventor： MAHMOUD ISSA SAID
Abstract: An anodizing bath for aluminum alloys is disclosed; the aqueous bath solution contains sulfuric acid, citric acid, urea, and ammoniated colloidal silica; the latter three components being a complexing agent, a levelling agent and a stabilizing agent, respectively, so as to result in an oxide layer having and amorphous structure which eliminates necessity of scaling thick anodic coating.
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Patent Agency Ranking
公开(公告)号：DE3883740D1
公开(公告)日：1993-10-07
申请号：DE3883740
申请日：1988-12-12
Applicant: IBM
Inventor： MAHMOUD ISSA SAID
Abstract: An anodizing bath for aluminum alloys is disclosed; the aqueous bath solution contains sulfuric acid, citric acid, urea, and ammoniated colloidal silica; the latter three components being a complexing agent, a levelling agent and a stabilizing agent, respectively, so as to result in an oxide layer having and amorphous structure which eliminates necessity of scaling thick anodic coating.
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公开(公告)号：DE69434192T2
公开(公告)日：2005-12-08
申请号：DE69434192
申请日：1994-10-28
Applicant: IBM
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公开(公告)号：DE3763747D1
公开(公告)日：1990-08-23
申请号：DE3763747
申请日：1987-03-24
Applicant: IBM
Inventor： MAHMOUD ISSA SAID
Abstract: An alloy for forming electrical contacts, comprises by weight Beryllium 1 - 2% Palladium 2 - 20%; and the balance being Nickel. The alloy may contain a trace amount (less than 0.01 per cent by weight) of titanium. An electrical contact may consist of a layer of gold deposited directly on a base of the beryllium/palladium/nickel alloy.
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公开(公告)号：DE3377656D1
公开(公告)日：1988-09-15
申请号：DE3377656
申请日：1983-10-26
Applicant: IBM
Inventor： BURNS RICHARD WAYNE , MAHMOUD ISSA SAID
Abstract: A method for preparing aluminium substrates for plating Nickel and copper thereon. This method includes sensitizing the surface of the substrates in a solution of sncl2 and HCL and activating said surface in a solution containing Pdcl2 and HCL.
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公开(公告)号：DE69431866D1
公开(公告)日：2003-01-23
申请号：DE69431866
申请日：1994-10-28
Applicant: IBM
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