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1.
公开(公告)号:DE3379522D1
公开(公告)日:1989-05-03
申请号:DE3379522
申请日:1983-07-19
Applicant: IBM , ATOMIC ENERGY AUTHORITY UK
Inventor: CAIRNS JAMES ANTHONY , ZIEGLER JAMES FRANCIS
Abstract: Coated ceramic substrates or structures having a barrier layer against alpha-particle radiation and integrated circuits prepared therefrom. Ceramic surfaces having reduced or modified surface roughness are also provided.As shown in the Figure the ceramic substrate is coated with a layer of high purity ceramic before the metallization layer is deposited. An electronic chip is then flip bonded to the coated substrate. In one example the coating is formed by applying droplets of a mix comprising a surfactant and a colloidal dispersion of alumina to the substrate, spinning the substrate and then drying the spun layer. Thereafter the ceramic is fired e.g. at 850°C for 15 minutes.
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公开(公告)号:DE2749593A1
公开(公告)日:1978-06-22
申请号:DE2749593
申请日:1977-11-05
Applicant: IBM
Inventor: CAIRNS JAMES ANTHONY , LURIO ALLEN , ZIEGLER JAMES FRANCIS
IPC: B23K15/00 , G01N23/225 , H01J37/244 , H01J37/317 , H01L21/265 , G01T1/29 , H01L21/26
Abstract: Practice of this disclosure obtains a measure of the dose or fluence of implanted ions into a target for device fabrication by monitoring emitted X-rays. Illustratively, ion beams of B+, P+ or As+ have been implanted into Si over the ion energy range of 20 KeV to 2800 KeV and the data of counts of emitted X-rays has been correlated with both the solid angle intercepted by the counter and the charge intercepted by the target. In particular, the low energy soft Si(L) X-rays at 136A have been discovered for the practice of this disclosure to be very intense. The principles of this disclosure are especially applicable for very low ion doses, i.e. APPROXLESS 1012/cm2 where charge integration is not feasible; and for neutral beam implantation with currents above about 2 milliamperes. Reproducible semiconductor devices can be fabricated by practice of this disclosure, i.e., with substantially reproducible operational characteristics, e.g., bipolar and field-effect transistors with silicon integrated circuit technology.
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