PHOTON ENERGY CONVERTER
    2.
    发明专利

    公开(公告)号:AU8575775A

    公开(公告)日:1977-04-21

    申请号:AU8575775

    申请日:1975-10-15

    Applicant: IBM

    Abstract: An efficient converter of photon energy to heat has been devised comprising a dense array of metal whiskers grown with spacings between the whiskers of a few wavelengths of visible light. The material selected, and tungsten is exemplary of such materials, has low emissivity, but achieves significant optical absorption by trapping the light impinging on the dense array by a geometric maze effect. The characteristics of the surface are excellent for the conversion of solar energy to heat.

    4.
    发明专利
    未知

    公开(公告)号:DE2539101A1

    公开(公告)日:1976-04-29

    申请号:DE2539101

    申请日:1975-09-03

    Applicant: IBM

    Abstract: An efficient converter of photon energy to heat has been devised comprising a dense array of metal whiskers grown with spacings between the whiskers of a few wavelengths of visible light. The material selected, and tungsten is exemplary of such materials, has low emissivity, but achieves significant optical absorption by trapping the light impinging on the dense array by a geometric maze effect. The characteristics of the surface are excellent for the conversion of solar energy to heat.

    8.
    发明专利
    未知

    公开(公告)号:DE2749593A1

    公开(公告)日:1978-06-22

    申请号:DE2749593

    申请日:1977-11-05

    Applicant: IBM

    Abstract: Practice of this disclosure obtains a measure of the dose or fluence of implanted ions into a target for device fabrication by monitoring emitted X-rays. Illustratively, ion beams of B+, P+ or As+ have been implanted into Si over the ion energy range of 20 KeV to 2800 KeV and the data of counts of emitted X-rays has been correlated with both the solid angle intercepted by the counter and the charge intercepted by the target. In particular, the low energy soft Si(L) X-rays at 136A have been discovered for the practice of this disclosure to be very intense. The principles of this disclosure are especially applicable for very low ion doses, i.e. APPROXLESS 1012/cm2 where charge integration is not feasible; and for neutral beam implantation with currents above about 2 milliamperes. Reproducible semiconductor devices can be fabricated by practice of this disclosure, i.e., with substantially reproducible operational characteristics, e.g., bipolar and field-effect transistors with silicon integrated circuit technology.

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