公开(公告)号：MY139067A

公开(公告)日：2009-08-28

申请号：MYPI9900524

申请日：1999-02-12

Applicant: IBM

Inventor： CARDEN TIMOTHY F ,  DEARING GLENN O ,  DESAI KISHOR V ,  ENGLE STEPHEN R ,  STUTZMAN RANDALL ,  THIEL GEORGE H

IPC: H01L23/02 ,  H01L21/50 ,  H01L23/10

Abstract: A CHIP CARRIER PACKAGE (10) THAT INCLUDES A COVER PLATE (20) ATTACHED TO THE STIFFENER (30) BY A REFLOWABLE BONDING MATERIAL (70, 72) IS DISCLOSED. ADDITIONALLY, A THERMALLY AND ELECTRICALLY CONDUCTIVE BONDING MATERIAL BETWEEN THE COVER PLATE AND THE CHIP (40) ITSELF MAY BE INCLUDED. ALSO A CHIP PACKAGE INCLUDING AN ALIGNMENT DEVICE (290) TO AID IN PROPERLY ALIGNING THE COVER PLATE ON THE STIFFENER IS DISCLOSED. FURTHERMORE, A METHOD OF PACKAGING A CHIP INCLUDING PROVIDING A REFLOWABLE MATERIAL BETWEEN THE COVER PLATE AND STIFFENER BODY FOR ATTACHING THE COVER PLATE TO THE STIFFENER, AND .SIMULTANEOUSLY ATTACHING THE COVER PLATE TO THE STIFFENER WITH AN ATTACHING OF THE CARRIER (50) TO AN ELECTRONIC CIRCUIT BOARD (80) IS DISCLOSED.