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    PROCESS FOR PROVIDING A LANDLESS THROUGH-HOLE CONNECTION
    3.
    发明专利
    PROCESS FOR PROVIDING A LANDLESS THROUGH-HOLE CONNECTION 未知

    公开(公告)号：CA1245774A

    公开(公告)日：1988-11-29

    申请号：CA528725

    申请日：1987-02-02

    Applicant: IBM

    Inventor： CHELLIS LEROY N ,  ELLIS THERON L

    IPC: H05K3/20 ,  H05K3/42 ,  H01K3/10

    Abstract: PROCESS FOR PROVIDING A LANDLESS THROUGH-HOLE CONNECTION At least two conductors are electrically connected through a dielectric material by providing a dielectric material having a first conductor on a first surface thereof and a temporary support layer covering the first conductor and the first surface of the dielectric material. A second surface on the dielectric material opposite the first surface is provided with a second conductor and a temporary support layer covering the second conductor and second surface of the dielectric material. Intersticial through-holes are provided to connect the first and second conductors. The through-holes are plated with an electrical conductor to thereby electrically connect the first and second conductors. The support layers are then mechanically removed such as by peeling to thereby provide a landless electrical connection between the first and second electrical conductors.

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