Patent search ap:("IBM") AND inv:"CHIYAARUZU EDOWAADO GIYAZUDEIT" Page 1

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发明专利
METHOD OF FORMING ELECTRONIC PACKAGE 失效

公开(公告)号：JPS5595394A

公开(公告)日：1980-07-19

申请号：JP14784779

申请日：1979-11-16

Applicant: IBM

Inventor： CHIYAARUZU EDOWAADO GIYAZUDEIT , DONARUDO JIIN MAKUBURAIDO

IPC: H05K1/00 , H01L21/48 , H01L21/60 , H01L23/538 , H05K1/03 , H05K1/14 , H05K1/18 , H05K3/00

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