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    APPARATUS FOR SUPPLY OF FLUID TO SUBSTRATE AND SUBSTRATE TREATMENT METHOD
    6.
    发明专利
    APPARATUS FOR SUPPLY OF FLUID TO SUBSTRATE AND SUBSTRATE TREATMENT METHOD 失效

    公开(公告)号：JPH0645733A

    公开(公告)日：1994-02-18

    申请号：JP8971093

    申请日：1993-04-16

    Applicant: IBM

    Inventor： MAIKERU JIEIMUZU KANESUTARO ,  DONARUDO JIIN MAKUBURAIDO ,  RUISU JIYOZEFU KONRADO ZA SAAD ,  RONARUDO JIEIMUZU MUUA

    IPC: C23F1/08 ,  B05C3/12 ,  B05C3/18 ,  B05C5/02 ,  C23G3/00 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/26 ,  H05K3/42

    Abstract: PURPOSE: To simply realize application for mass production environment by supplying various kinds of fluids to the surface of a substrate which is arranged in an equipment with different speed and time. CONSTITUTION: When both of the surfaces of a substrate 11 is treated, it is preferable that each of parts 15, 17 contain a first channel 31, positioned at a first set distance D1 from the respective surfaces of a substrate 11 adjacent to the part 15 and the part 17. The first channel 31 is designed so that fluid 33 is accepted in the first channel, since the fluid collides against the adjacent surface of the substrate 11, while moving at a first speed. Further the respective parts 15, 17 are positioned at a second set distance D2 from the respective adjacent surfaces of the substrate 11 and further contain a weir 35, which is used for making the fluid 37 exceed the weir and flow. The weir 35 is positioned at the second distance D2, in order that the fluid 37 passing on the weir moves at a speed higher than that of the fluid 33 in the first channel 31.

    CONTROL OF CONTAMINANT IN ELECTROLESS PLATING BATH
    7.
    发明专利
    CONTROL OF CONTAMINANT IN ELECTROLESS PLATING BATH 失效

    公开(公告)号：JPS6320485A

    公开(公告)日：1988-01-28

    申请号：JP9216287

    申请日：1987-04-16

    Applicant: IBM

    Inventor： DONARUDO JIIN MAKUBURAIDO ,  ROBAATO JIYOOJI RITSUKAATO

    IPC: C23C18/31 ,  C23C18/16 ,  C23C18/40 ,  H05K3/18

    Abstract: An electroless plating bath (11) is selectively cleaned of organic contaminants. The organic contaminants are detected by measuring the capacitance between a working electrode (26) and counter electrode (27) with a potentiostat (31). The capacitance measurements are used to indicate the level of organic contaminants. Exposure of the dummy plating surface (39) in the electroless plating bath is controlled such that the exposed surface is directly proportional to the detected level of organic contaminants.

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