INTERMITTENT DELTA-SHAPED DOPING IN SI AND SIGE FILMS BY UHV-CVD

    公开(公告)号:JPH1167666A

    公开(公告)日:1999-03-09

    申请号:JP16830998

    申请日:1998-06-16

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To enhance a p-doping concentration such as in CMOS logic or the like so as to make a thin layer structure, by growing, on an upper surface, a first epitaxial layer composed of Ge which has been doped at a specified concentration with a thickness being less than a critical level, and further growing a second epitaxial layer composed of Si or SiGe. SOLUTION: This structure includes a single-crystal semiconductor substrate 32 having an upper surface 33, a first epitaxial layer 36 formed on the upper surface 33, and a second epitaxial layer 40 formed on the first epitaxial layer 36. The first epitaxial layer 36 has a thickness less than a critical thickness and a dopant concentration exceeding 5×10 atoms/cc, and has an intermittent doping profile structure, the dopant being selected from groups composed of phosphorus and arsenic. The second layer 40 contains a material selected from groups consisting of Si and SiGe. The thickness of the first layer 36 ranges 0.5-2 nm.

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