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公开(公告)号：DE68912486D1
公开(公告)日：1994-03-03
申请号：DE68912486
申请日：1989-09-20
Applicant: IBM
Inventor： DESOUCHES ALAIN MICHEL , PAL GEORGE STEPHEN , SALO MICHAEL PAUL , ULLAH MUHAMMAD INAYET , CHURCH MARK ANTHONY , DESHPANDE ANNAYYA PRALHADRAO
Abstract: Each of a row of thin film magnetic transducers (12) formed on a substrate, comprises a magnetoresistive (MR) element, and the row is supported on a holder (18) which has an elongate H-shaped slot near one edge to form a beam member upon which the row is mounted. The beam member is capable of being deflected in a substantially quadratic curvature when subjected to pressure from a pressure transducer (22) at the middle of the beam member. The resistance of each of the MR elements is measured (by 28, 30) during lapping, and control signals are generated (by controller 32) to control the pressure transducers to control lapping with proper BALANCE and BOW and to terminate lapping when the desired MR element height is reached.
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公开(公告)号：DE3373582D1
公开(公告)日：1987-10-15
申请号：DE3373582
申请日：1983-06-16
Applicant: IBM
Inventor： CHURCH MARK ANTHONY , DECKER STEPHEN KEITH
Abstract: In an assembly consisting of an inductive write device comprising first and second magnetic thin film pole pieces (14, 16) separated by a non-magnetic transducing gap, a magnetoresistive read element (24) disposed in the transducing gap and conductors (36, 38) in electrical contact with the magnetoresistive read element (24), the first pole piece (14) is planar and each of the magnetoresistive element and the conductive elements have a planar form and are disposed within the perimeter of the first pole piece (14).
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公开(公告)号：AU524436B2
公开(公告)日：1982-09-16
申请号：AU5295079
申请日：1979-11-19
Applicant: IBM
Inventor： CHURCH MARK ANTHONY , JONES ROBERT EDWARD JR
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公开(公告)号：DE69012850T2
公开(公告)日：1995-03-30
申请号：DE69012850
申请日：1990-02-07
Applicant: IBM
Inventor： CHANG MIKE YU-CHIEH , CHURCH MARK ANTHONY , SALO MICHAEL PAUL
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Patent Agency Ranking
公开(公告)号：DE68912486T2
公开(公告)日：1994-06-23
申请号：DE68912486
申请日：1989-09-20
Applicant: IBM
Inventor： DESOUCHES ALAIN MICHEL , PAL GEORGE STEPHEN , SALO MICHAEL PAUL , ULLAH MUHAMMAD INAYET , CHURCH MARK ANTHONY , DESHPANDE ANNAYYA PRALHADRAO
Abstract: Each of a row of thin film magnetic transducers (12) formed on a substrate, comprises a magnetoresistive (MR) element, and the row is supported on a holder (18) which has an elongate H-shaped slot near one edge to form a beam member upon which the row is mounted. The beam member is capable of being deflected in a substantially quadratic curvature when subjected to pressure from a pressure transducer (22) at the middle of the beam member. The resistance of each of the MR elements is measured (by 28, 30) during lapping, and control signals are generated (by controller 32) to control the pressure transducers to control lapping with proper BALANCE and BOW and to terminate lapping when the desired MR element height is reached.
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公开(公告)号：AU5295079A
公开(公告)日：1980-06-26
申请号：AU5295079
申请日：1979-11-19
Applicant: IBM
Inventor： CHURCH MARK ANTHONY , JONES ROBERT EDWARD JR
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公开(公告)号：DE69012850D1
公开(公告)日：1994-11-03
申请号：DE69012850
申请日：1990-02-07
Applicant: IBM
Inventor： CHANG MIKE YU-CHIEH , CHURCH MARK ANTHONY , SALO MICHAEL PAUL
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公开(公告)号：DE3769224D1
公开(公告)日：1991-05-16
申请号：DE3769224
申请日：1987-02-13
Applicant: IBM
Inventor： CHURCH MARK ANTHONY
Abstract: A method for determining the position of a lapped edge (23) of a substrate (11) during lapping of a row of thin film magnetic transducer elements (30). First and second electrical lapping guide structures (21, 22) are formed on each side of the row of transducer elements. The lapping guide structures include a series of switching junctions (32-35), each switching junction paralleled by a resistor (38-41). A lapping resistor (31) which provides a change in resistance proportional to the lapping of the row is measured and compared with the position of the lapping plane as determined from each switching junction change of state. Calibration of the resistor versus lapping plane position is effected to permit an accurate determination of the lapped surface from subsequent resistance measurements of the lapping resistor.
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