1.
    发明专利
    未知

    公开(公告)号:DE69209930D1

    公开(公告)日:1996-05-23

    申请号:DE69209930

    申请日:1992-07-11

    Applicant: IBM

    Abstract: An electronic cage (10) for housing electronic components (circuit boards and power supplies) therein, wherein the cage includes a box-like component receiving area (21) defined by a plurality of upstanding side walls (17, 18, 19, 20) and a floor member (11). Part of the floor member projects from the box-like receiving area (21) to thus expose various electronic devices (e.g., modules, connectors) located on a common, large board which may be positioned within the cage. Significantly, the cage is of one-piece construction, preferably of injection molded structural foam.

    2.
    发明专利
    未知

    公开(公告)号:DE68917694D1

    公开(公告)日:1994-09-29

    申请号:DE68917694

    申请日:1989-11-03

    Applicant: IBM

    Abstract: A circuit assembly (10) (e.g., printed circuit board) including an insulative substrate (13) having opposed surfaces (15, 17) each defining a walled opening (25) therein. Each walled opening includes a layer (31) of conductive material (e.g., copper) plated thereon, these openings being electrically connected through a common channel (35) or the like, which channel in turn has been plated to include copper material therein. Located within each opening is a compliant contact pin (41, 43) including a compliant end portion (45) designed to provide an interference fit within one of the respective openings and an extending portion (61) designed for extending from the board's outer surfaces to be electrically connected to a designated external component (e.g., printed circuit board, wiring, conductive socket). Utilization of opposed pins, walled openings, and a narrow channel as defined herein allows the greater utilization of board internal volume to thus accommodate higher circuit densities particularly in the areas of the insulative board between the spaced apart, plated openings.

    3.
    发明专利
    未知

    公开(公告)号:DE69209930T2

    公开(公告)日:1996-10-24

    申请号:DE69209930

    申请日:1992-07-11

    Applicant: IBM

    Abstract: An electronic cage (10) for housing electronic components (circuit boards and power supplies) therein, wherein the cage includes a box-like component receiving area (21) defined by a plurality of upstanding side walls (17, 18, 19, 20) and a floor member (11). Part of the floor member projects from the box-like receiving area (21) to thus expose various electronic devices (e.g., modules, connectors) located on a common, large board which may be positioned within the cage. Significantly, the cage is of one-piece construction, preferably of injection molded structural foam.

    4.
    发明专利
    未知

    公开(公告)号:DE68917694T2

    公开(公告)日:1995-03-30

    申请号:DE68917694

    申请日:1989-11-03

    Applicant: IBM

    Abstract: A circuit assembly (10) (e.g., printed circuit board) including an insulative substrate (13) having opposed surfaces (15, 17) each defining a walled opening (25) therein. Each walled opening includes a layer (31) of conductive material (e.g., copper) plated thereon, these openings being electrically connected through a common channel (35) or the like, which channel in turn has been plated to include copper material therein. Located within each opening is a compliant contact pin (41, 43) including a compliant end portion (45) designed to provide an interference fit within one of the respective openings and an extending portion (61) designed for extending from the board's outer surfaces to be electrically connected to a designated external component (e.g., printed circuit board, wiring, conductive socket). Utilization of opposed pins, walled openings, and a narrow channel as defined herein allows the greater utilization of board internal volume to thus accommodate higher circuit densities particularly in the areas of the insulative board between the spaced apart, plated openings.

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