公开(公告)号：DE3685112D1

公开(公告)日：1992-06-04

申请号：DE3685112

申请日：1986-10-03

Applicant: IBM

Inventor： POCH LEONARD JOHN ,  PROGOVITZ RICHARD FRANCIS ,  SALACKA FRANK STEPHEN ,  STANTON KIMBALL ANDREW ,  STUBECKI JOHN ARTHUR ,  WERBIZKY GEORGE GREGORY ,  WINKLER PAUL EDWARD ,  ADAMS KIRK DUANE ,  ALBRECHTA JOSEPH JR ,  BABUKA ROBERT ,  BEAUDRY JOHN S JR ,  ARVANITAKIS NICOLAOS CONSTANTI ,  BOCINSKI TERRENCE EDWARD ,  COSIMANO RAYMOND JOSEPH ,  ENGLISH JOHN JONES ,  KMAN STEPHEN JOSEPH ,  MCKEOWN JAMES EDWARD ,  PETROZELLO JAMES RALPH

IPC: H05K7/14

Abstract: The retention appts. includes a member (30) for moving the object e.g. a printed circuit rard, in a direction towards a given position at which the object is to be held. The member is moved by an actuator (61,62) from which resilient members (79,80) extend outwardly and incident to the direction. A member (28) is provided to stop the movement of the object in the first direction at the given position. The actmator is operably movable in the direction, when the object is stopped by the stop member, to deflect the resilient members to bias the object in the direction to prevent displacement of the object when at the given position.

公开(公告)号：DE3879737T2

公开(公告)日：1993-10-07

申请号：DE3879737

申请日：1988-01-19

Applicant: IBM

Inventor： WERBIZKY GEORGE GREGORY

IPC: H01L23/50 ,  H01L23/32 ,  H05K7/10

Abstract: A pluggable, high density, reliable integrated circuit package is disclosed. The package has a plurality of integrated circuit chips mounted on a multilayer ceramic substrate. Input-output signals are provided to the module (10) by means of mating male female input-output pins (12) which are located on the bottom of the module (10). Power is provided to the module (10) from a multilayer ceramic frame (20) through an edge connector (27) that is an integral part of the multilayer ceramic substrate. Matching circuit vias (41) located on the edge of the multilayer ceramic substrate (10) and on the edge of the multilayer ceramic frame (20) are cut and tinned with tin-lead (42) to provide power input connections. When the module is plugged into the circuit board (30) the edge connectors (17) on the module (10) mate with the edge connectors (27) in the ceramic frame (20). Since the frame (20) is made of the same material as the module substrate, the power connectors (17, 27) have excellent thermal match and they are highly reliable.

公开(公告)号：DE3879737D1

公开(公告)日：1993-05-06

申请号：DE3879737

申请日：1988-01-19

Applicant: IBM

Inventor： WERBIZKY GEORGE GREGORY

IPC: H01L23/50 ,  H01L23/32 ,  H05K7/10

Abstract: A pluggable, high density, reliable integrated circuit package is disclosed. The package has a plurality of integrated circuit chips mounted on a multilayer ceramic substrate. Input-output signals are provided to the module (10) by means of mating male female input-output pins (12) which are located on the bottom of the module (10). Power is provided to the module (10) from a multilayer ceramic frame (20) through an edge connector (27) that is an integral part of the multilayer ceramic substrate. Matching circuit vias (41) located on the edge of the multilayer ceramic substrate (10) and on the edge of the multilayer ceramic frame (20) are cut and tinned with tin-lead (42) to provide power input connections. When the module is plugged into the circuit board (30) the edge connectors (17) on the module (10) mate with the edge connectors (27) in the ceramic frame (20). Since the frame (20) is made of the same material as the module substrate, the power connectors (17, 27) have excellent thermal match and they are highly reliable.