公开(公告)号：JPH11179725A

公开(公告)日：1999-07-06

申请号：JP5657898

申请日：1998-03-09

Applicant: IBM

Inventor： HEDRICK JEFFREY C ,  DAVID ANDREW LEWIS ,  COSTAS PAPATHOMAS ,  STEPHEN LEO TEASDALE ,  VIEHBECK ALFRED ,  STANLEY J WHITEHAIR

IPC: C08J3/03 ,  B05D7/00 ,  B29B11/16 ,  B29K105/06 ,  C08J3/075 ,  C08J5/24 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing printed wiring circuit boards which eliminates use of a large vol. of org. solvents. SOLUTION: High quality, in-spec prepregs are obtd. by utilization of water- based epoxy resin emulsions. These prepregs are identical to those prepd. by using conventional org. solvents and have the same level of B-stage cure and comparable rheological properties with the conventional prepregs. Laminates fabricated from these prepregs possess equivalent or improved thermal, adhesive and hydroscopic properties to the conventional prepregs.