公开(公告)号：CA2081142A1

公开(公告)日：1993-07-29

申请号：CA2081142

申请日：1992-10-22

Applicant: IBM

Inventor： COURTENS ERIC ,  MANNHART JOCHEN

IPC: C01G1/00 ,  C01G3/00 ,  H01B12/00 ,  H01B13/00 ,  H01L39/02 ,  H01L39/24 ,  H01L39/12

Abstract: PINNING STRUCTURES FOR SUPERCONDUCTING FILMS AND METHOD FOR MAKING SAME The pinning structure for high-Tc superconductors comprises a substrate (1), a plurality of protrusions (3) of nanometer dimension and with mutual distances in the nanometer range, deposited on the surface (2) of said substrate (1), and a superconducting film (4) deposited on said substrate (1) and embedding said protrusions (3) in a superconductor matrix. The protrusions (3) may consist of a metal, or a semiconductor, or an insulator. The manufacturing of the pinning structure starts from a substrate (1) onto which a predetermined number of protrusions (3) is deposited in predetermined locations as required by the specific application. Finally, the superconductor film (4) is deposited on top of the same substrate (1).