公开(公告)号：DE69303332T2

公开(公告)日：1997-01-23

申请号：DE69303332

申请日：1993-04-19

Applicant: IBM

Inventor： CURRIE JAMES EDWARD ,  SCHULZ RONALD NORMAN ,  TICKNOR ADAM DAN

IPC: B23Q3/08 ,  B24B37/30 ,  H01L21/304 ,  B24B37/04

Abstract: A wafer polishing fixture is disclosed containing a first liquid film (6) confined by a non-porous but flexible enclosure (2,8) for distributing evenly the applied polishing forces across the surface of a wafer (7) supported by the confined liquid (6). The fixture comprises a flexible, non-porous template (2) with a pocket (5) for receiving a wafer (7) to be polished. A washer (4) is placed between a carrier (3) and the template pocket (5). A film of water (6) fills the bottom of the pocket (5) and is confined with the aid of the washer (4) and by an overlying porous pad (9) extending across the pocket (5) and having a non-porous sheath (8) facing the liquid (6). A second liquid film (10) saturates and covers the upper surface of the pad (9). The wafer (7) to be polished floats upon the second liquid film (10) within the pocket (5).

公开(公告)号：DE69303332D1

公开(公告)日：1996-08-01

申请号：DE69303332

申请日：1993-04-19

Applicant: IBM

Inventor： CURRIE JAMES EDWARD ,  SCHULZ RONALD NORMAN ,  TICKNOR ADAM DAN

IPC: B23Q3/08 ,  B24B37/30 ,  H01L21/304 ,  B24B37/04

Abstract: A wafer polishing fixture is disclosed containing a first liquid film (6) confined by a non-porous but flexible enclosure (2,8) for distributing evenly the applied polishing forces across the surface of a wafer (7) supported by the confined liquid (6). The fixture comprises a flexible, non-porous template (2) with a pocket (5) for receiving a wafer (7) to be polished. A washer (4) is placed between a carrier (3) and the template pocket (5). A film of water (6) fills the bottom of the pocket (5) and is confined with the aid of the washer (4) and by an overlying porous pad (9) extending across the pocket (5) and having a non-porous sheath (8) facing the liquid (6). A second liquid film (10) saturates and covers the upper surface of the pad (9). The wafer (7) to be polished floats upon the second liquid film (10) within the pocket (5).