公开(公告)号：HK1018999A1

公开(公告)日：2000-01-14

申请号：HK98111592

申请日：1998-10-29

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  DAREKAR VIJAY S ,  GAYNES MICHAEL A ,  SARAF RAVI F

IPC: B05D3/02 ,  B05D7/16 ,  B23K35/00 ,  B23K35/02 ,  B23K35/34 ,  B23K35/36 ,  C23C22/02 ,  C23C22/68 ,  C23C30/00 ,  C23F11/14 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K ,  C23F ,  B23K

Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.