公开(公告)号：JPH11343466A

公开(公告)日：1999-12-14

申请号：JP9896799

申请日：1999-04-06

Applicant: IBM

Inventor： GAYNES MICHAEL A ,  KODNANI RAMESH R

IPC: C09J5/00 ,  F16B11/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for substantially removing voids, when two surfaces, particularly flat surfaces are integrally jointed and obtain assemblies and articles produced through the method. SOLUTION: A single point adhesive contact 3 attachment is given on the surface 1 and the adhesive 4 is radially extended from the attachment at the center in a spoke wheel and covering substantially all over the surface with diagonally crossing adhesive bands whereby the surfaces are integrally jointed through the adhesive. The surface 2 is pressed integrally as the adhesive is intervened between the surfaces so that the adhesive extends and cover the surface all over whereby the surfaces 2 are jointed integrally.

公开(公告)号：DE112012004476B4

公开(公告)日：2019-08-29

申请号：DE112012004476

申请日：2012-10-10

Applicant: IBM

Inventor： COLGAN EVAN G ,  GAYNES MICHAEL A ,  ZITZ JEFFREY A

IPC: H01L21/50 ,  H01L23/34 ,  H01L23/42 ,  H05K7/20

Abstract: Montageverfahren für ein Wärmesenken-Befestigungsmodul für eine Chipverkapselungsvorrichtung, das Verfahren aufweisend:- Befestigen eines Halbleiterchips (10) an einem Substrat (20), um einen Modul-Teilaufbau (30) zu bilden;- Anordnen eines Lastrahmens (90) und einer Distanzscheibe (80) in einer Halterung (40);- Auftragen von Klebstoff (100) auf den Lastrahmen (90);- belastbares Anordnen des Modul-Teilaufbaus mit der Chipvorderseite nach unten in der Halterung; und- Härten des Klebstoffs.

公开(公告)号：GB2510300A

公开(公告)日：2014-07-30

申请号：GB201408501

申请日：2012-10-10

Applicant: IBM

Inventor： COLGAN EVAN ,  GAYNES MICHAEL A ,  ZITZ JEFFREY A

IPC: H05K7/20 ,  H01L21/50 ,  H01L23/34 ,  H01L23/40 ,  H01L23/433

Abstract: A chip packaging apparatus includes a substrate, a load frame attached to the substrate by an adhesive material, the load frame being formed to define an aperture and a semiconductor chip mounted on the substrate within the aperture. A thickness of the adhesive material between the load frame and the substrate is varied and adjusted such that a surface of the load frame opposite the substrate is disposed substantially in parallel to a surface of the chip opposite the substrate.

公开(公告)号：ID24794A

公开(公告)日：2000-08-16

申请号：ID991157

申请日：1999-12-20

Applicant: IBM

Inventor： EGITTO FRANK D ,  GAYNES MICHAEL A ,  KODNANI RAMESH ,  MATIONSO LUIS J ,  PIERSON MARK V

IPC: B29C59/14 ,  H01L21/56 ,  D03D11/00

公开(公告)号：DE112012004476T5

公开(公告)日：2014-07-10

申请号：DE112012004476

申请日：2012-10-10

Applicant: IBM

Inventor： GAYNES MICHAEL A ,  ZITZ JEFFREY A ,  COLGAN EVAN G

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/40

Abstract: Eine Chipverkapselungsvorrichtung umfasst ein Substrat, einen Lastrahmen, welcher mit einem Klebstoffmaterial an dem Substrat befestigt ist, wobei der Lastrahmen so gebildet ist, dass er eine Öffnung definiert, und einen Halbleiterchip, welcher innerhalb der Öffnung an dem Substrat angebracht ist. Eine Dicke des Klebstoffmaterials zwischen dem Lastrahmen und dem Substrat variiert und wird so eingestellt, dass eine Fläche des Lastrahmens gegenüber dem Substrat im Wesentlichen parallel zu einer Fläche des Chips gegenüber dem Substrat angeordnet ist.

公开(公告)号：HK1018999A1

公开(公告)日：2000-01-14

申请号：HK98111592

申请日：1998-10-29

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  DAREKAR VIJAY S ,  GAYNES MICHAEL A ,  SARAF RAVI F

IPC: B05D3/02 ,  B05D7/16 ,  B23K35/00 ,  B23K35/02 ,  B23K35/34 ,  B23K35/36 ,  C23C22/02 ,  C23C22/68 ,  C23C30/00 ,  C23F11/14 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K ,  C23F ,  B23K

Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.

公开(公告)号：GB2510300B

公开(公告)日：2015-12-02

申请号：GB201408501

申请日：2012-10-10

Applicant: IBM

Inventor： COLGAN EVAN G ,  GAYNES MICHAEL A ,  ZITZ JEFFREY A

IPC: H05K7/20 ,  H01L21/50 ,  H01L23/34 ,  H01L23/40 ,  H01L23/433

公开(公告)号：CA2704683A1

公开(公告)日：2010-08-12

申请号：CA2704683

申请日：2010-05-28

Applicant: IBM CANADA

Inventor： BLANDER ALEXANDRE ,  BEAUMIER MARTIN ,  GAGNON PASCALE ,  GAYNES MICHAEL A ,  GIGUERE ERIC ,  SALVAS ERIC ,  TOUSIGNANT LUC

IPC: H01L23/06 ,  H01L23/58

Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.