公开(公告)号：DE69007180D1

公开(公告)日：1994-04-14

申请号：DE69007180

申请日：1990-05-21

Applicant: IBM

Inventor： DAUGHENBAUGH GERALD ALLEN ,  RIGBY EUGENE BERTRAND

IPC: C03C8/22 ,  C03C3/072 ,  C03C3/089 ,  C03C8/24 ,  G11B5/255 ,  G11B5/29

公开(公告)号：DE69007180T2

公开(公告)日：1994-09-22

申请号：DE69007180

申请日：1990-05-21

Applicant: IBM

Inventor： DAUGHENBAUGH GERALD ALLEN ,  RIGBY EUGENE BERTRAND

IPC: C03C8/22 ,  C03C3/072 ,  C03C3/089 ,  C03C8/24 ,  G11B5/255 ,  G11B5/29

公开(公告)号：DE3065320D1

公开(公告)日：1983-11-17

申请号：DE3065320

申请日：1980-11-26

Applicant: IBM

Inventor： DAUGHENBAUGH GERALD ALLEN ,  KOOB PHILIP WILLIAM ,  MOXLEY ARTHUR EUGENE ,  WALLACE JOSEPH EUGENE

IPC: G11B5/255 ,  G11B5/39 ,  G11B5/30 ,  G11B5/40

Abstract: A magnetoresistive head assembly comprises a silicon substrate, a magnetoresistive element mounted on the substrate, and sapphire members formed around said substrate in a sandwich type configuration. The portion of the head which interacts in transducing relation with a magnetic medium is so configured as to realize improved wear characteristics as well as good heat dissipation with low thermal noise.