公开(公告)号：JPH11315384A

公开(公告)日：1999-11-16

申请号：JP3487499

申请日：1999-02-12

Applicant: IBM

Inventor： DAVID JOHN RUSSELL ,  GERALD WALTER JONES ,  HEIKE MARCELLO ,  BOYA RISTA MARKOVICH

IPC: C23C18/18 ,  C23C18/31 ,  G03F7/038 ,  H05K3/00 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide a method for selectively applying electroless plating of metal, particularly gold and copper on a substrate such as a circuited substrate. SOLUTION: This method contains a stage in which the surface of a substrate 12 is applied with a dielectric permanent plating resist 16 contg. about 10 to 80% phenoxypolyol resin of about 40,000 to 130,000 molecular weight which is a condensate of epichloro-hydrin and bisphenol A, about 20 to 90% epoxidated multifunctional bisphenol A-formaldehyde-novolak resin of about 4,000 to 10,000 molecular weight, about 35 to 50% diglycidyl-ether of bisphenol A of about 600 to 2,500 and a cationic photoinitiator and capable of photoimaging by curing, a stage in which the permanent plating resist 16 is photopatterned, and the opening 18 exposing the region of the substrate 12 is formed therein and a stage in which the exposed region of the substrate 12 is applied with electroless plating of metal.