METHOD FOR FORMING BiMOS
    1.
    发明专利

    公开(公告)号:JP2001185634A

    公开(公告)日:2001-07-06

    申请号:JP2000340616

    申请日:2000-11-08

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a method for forming a BiMOS integrated circuit in which an FET and a bipolar element are formed on the same substrate. SOLUTION: The method for forming a BiMOS integrated circuit comprises a step for forming a collector at the first part of a bipolar element in the first region of a substrate, a step for protecting the first part of the bipolar element by forming a first protective layer on the first region, a step for forming a field effect transistor element in the second region of the substrate, a step for protecting the field effect transistor element by forming a second protective layer on the second region of the substrate, a step for removing the first protective layer, a step for forming a base and an emitter at the second part of the bipolar element, and a step for removing the second protective layer.

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