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    FUNCTIONAL PACKAGE FOR COMPLEX ELECTRONIC SYSTEMS AND METHOD OF FABRICATION
    2.
    发明专利
    FUNCTIONAL PACKAGE FOR COMPLEX ELECTRONIC SYSTEMS AND METHOD OF FABRICATION 未知

    公开(公告)号：CA1037615A

    公开(公告)日：1978-08-29

    申请号：CA233998

    申请日：1975-08-19

    Applicant: IBM

    Inventor： DAVIDSON LEWIS A ,  DUFFY MICHAEL C ,  ERICKSON ALVARD J ,  GUNTHER-MOHR GERARD R ,  WILLIAMS RICHARD A

    IPC: H05K1/02 ,  H01L21/60 ,  H01L23/02 ,  H01L23/04 ,  H01L23/36 ,  H01L23/538 ,  H05K1/14 ,  H05K7/20

    Abstract: A FUNCTIONAL PACKAGE FOR COMPLEX ELECTRONIC SYSTEMS AND METHOD OF FABRICATION The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteristics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at low cost, more flexibility and suitable for complex electronics system.

    3.
    发明专利
    未知

    公开(公告)号：FR2284190A1

    公开(公告)日：1976-04-02

    申请号：FR7521491

    申请日：1975-07-04

    Applicant: IBM

    Inventor： DAVIDSON LEWIS A ,  DUFFY MICHAEL C ,  ERICKSON ALVARD J ,  GUNTHER-MOHR GERARD R ,  WILLIAMS RICHARD A

    IPC: H01L21/60 ,  H01L23/02 ,  H01L23/04 ,  H01L23/36 ,  H05K1/02 ,  H01L23/538 ,  H05K1/14 ,  H01L23/34 ,  H01L21/96 ,  H01L23/32

    Abstract: The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteristics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at a low cost, more flexibility and suitable for complex electronics system.

    4.
    发明专利
    未知

    公开(公告)号：DE2536316A1

    公开(公告)日：1976-03-18

    申请号：DE2536316

    申请日：1975-08-14

    Applicant: IBM

    Inventor： DAVIDSON LEWIS A ,  DUFFY MICHAEL C ,  ERICKSON ALVARD J ,  GUNTHER-MOHR GERARD R ,  WILLIAMS RICHARD A

    IPC: H05K1/02 ,  H01L21/60 ,  H01L23/02 ,  H01L23/04 ,  H01L23/36 ,  H01L23/538 ,  H05K1/14 ,  H05K3/36

    Abstract: The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteristics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at a low cost, more flexibility and suitable for complex electronics system.

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