公开(公告)号：US3416224A

公开(公告)日：1968-12-17

申请号：US53275466

申请日：1966-03-08

Applicant: IBM

Inventor： ARMSTRONG WILLIAM J ,  HEALY ALBERT M ,  DUFFY MICHAEL C

IPC: H01L21/762 ,  H01L21/764 ,  H01L23/29

CPC classification number: H01L21/764 ,  H01L21/76264 ,  H01L21/76275 ,  H01L21/76289 ,  H01L23/291 ,  H01L2924/0002 ,  Y10S148/043 ,  Y10S148/085 ,  H01L2924/00

公开(公告)号：US3660250A

公开(公告)日：1972-05-02

申请号：US3660250D

申请日：1970-08-31

Applicant: IBM

Inventor： DUFFY MICHAEL C ,  HUDSON RICHARD L

IPC: G01N27/04 ,  G01R31/26 ,  H01L23/29

CPC classification number: G01R31/2637 ,  G01N27/041 ,  H01L23/291 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

Abstract: A machine and method for automatically determining the distribution of impurities contained in a semiconductor body. The machine is particularly useful in determining the depth of very shallow junctions in the order of one-half micron and less. The machine successively anodizes the surface of the semiconductor body to produce an anodized semiconductor layer, removes the anodized layer by chemical etching, measures an electrical characteristic, such as spreading resistance and sheet resistance, of the semiconductor body and records the electrical characteristic in terms of the characteristic versus the amount of material removed. The machine automatically repeats this cycle until a resistivity profile for the desired depth of material is obtained. A sharp change will be observed in the recorded profile of the electrical characteristic versus the amount of material removed when a PN junction is crossed.

Abstract translation: 一种用于自动确定包含在半导体本体中的杂质分布的机器和方法。 该机器特别适用于确定非常浅的接头的深度为半微米和更小的数量级。 该机器依次阳极氧化半导体主体的表面以产生阳极化半导体层，通过化学蚀刻去除阳极氧化层，测量半导体本体的电特性，例如耐扩散电阻和薄层电阻，并记录电特性 特征与去除材料的数量。 机器自动重复此循环，直到获得所需材料深度的电阻率曲线。 在记录的电气特征曲线相对于PN结交叉处移除的材料量将会发生急剧变化。

公开(公告)号：US3490962A

公开(公告)日：1970-01-20

申请号：US3490962D

申请日：1966-04-25

Applicant: IBM

Inventor： DUFFY MICHAEL C ,  KENNEDY DAVID P ,  MURLEY PHILIP C ,  ARMSTRONG WILLIAM J ,  SEABOLDT JACK JAY

IPC: H01L21/00 ,  H01L21/22 ,  H01L29/00 ,  H01L7/44

CPC classification number: H01L21/22 ,  H01L21/00 ,  H01L29/00 ,  Y10S148/043 ,  Y10S148/106 ,  Y10S148/167

公开(公告)号：US3655457A

公开(公告)日：1972-04-11

申请号：US3655457D

申请日：1968-08-06

Applicant: IBM

Inventor： DUFFY MICHAEL C ,  SCHUMANN PAUL A JR ,  YEH TSU-HSING

IPC: H01L21/76 ,  H01L21/00 ,  H01L21/265 ,  H01L21/322 ,  H01L21/331 ,  H01L21/337 ,  H01L21/74 ,  H01L21/761 ,  H01L21/82 ,  H01L21/822 ,  H01L21/8222 ,  H01L27/00 ,  H01L27/04 ,  H01L29/08 ,  H01L29/167 ,  H01L29/73 ,  H01L29/808 ,  H01L7/00

CPC classification number: H01L29/167 ,  H01L21/00 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/26586 ,  H01L21/3221 ,  H01L21/74 ,  H01L21/761 ,  H01L21/82 ,  H01L21/8222 ,  H01L27/00 ,  H01L29/0821 ,  Y10S148/062 ,  Y10S148/085 ,  Y10S148/151 ,  Y10S438/904

Abstract: Monolithic integrated circuits are made utilizing various ion implantation techniques for making diodes, transistors, resistors, capacitors, underpass connections, sub-collector junctions, etc., and for altering impurity profiles, gold doping, trimming resistance values, altering junctions depth, and isolating regions.

Abstract translation: 使用各种离子注入技术制造单片集成电路，用于制造二极管，晶体管，电阻器，电容器，地下通道连接，子集电极结等，并且用于改变杂质分布，金掺杂，修整电阻值，改变接合深度和隔离 地区。

公开(公告)号：US3577044A

公开(公告)日：1971-05-04

申请号：US3577044D

申请日：1968-04-08

Applicant: IBM

Inventor： ARMSTRONG WILLIAM J ,  HEALY ALBERT M ,  DUFFY MICHAEL C

IPC: H01L21/762 ,  H01L23/29 ,  H01L19/00

CPC classification number: H01L21/76297 ,  H01L21/76264 ,  H01L21/76275 ,  H01L21/76289 ,  H01L23/291 ,  H01L2924/0002 ,  Y10S148/085 ,  H01L2924/00

Abstract: This invention is directed generally to integrated semiconductor devices including fabrication methods therefor and, more particularly, to insulator encapsulated, dielectrically isolated, integrated semiconductor devices including fabrication methods therefor.

公开(公告)号：US3554891A

公开(公告)日：1971-01-12

申请号：US3554891D

申请日：1967-12-22

Applicant: IBM

Inventor： DUFFY MICHAEL C ,  HUDSON RICHARD L

IPC: G01N27/04 ,  G01R31/26 ,  G01R31/28 ,  H01L23/29 ,  B01K3/00

CPC classification number: G01R31/2831 ,  G01N27/041 ,  G01R31/2637 ,  H01L23/291 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A MACHINE AND METHOD FOR AUTOMATICALLY DETERMINING THE DISTRIBUTION OF IMPURITIES CONTAINED IN A SEMICONDUCTOR BODY. THE MACHINE IS PARTICULARLY USEFUL IN DETEMINING THE DEPTH OF VERY SHALLOW JUNCTIONS IN THE ORDER OF 1/2 MICRON AND LESS. THE MACHINE SUCESSIVELY ANODIZES THE SURFACE OF THE SEMICONDUCTOR BODY TO PRODUCE AN ANODIZED SEMICONDUTOR LAYER, REMOVES THE ANODIZED LAYER BY CHEMICAL ETCHING, MEASURES AN ELECTRICAL CHARACTERISTIC, SUCH AS A SPREADING RESISTANCE AND SHEET RESISTANCE, OF THE SEIMICONDUCTOR BODY AND RECORDS THE ELECTRICAL CHARACTERISTIC IN TERMS OF THE CHARACTERISTIC VERSUS THE AMOUNT OF MATERIAL REMOVED. THE MACHINE AUTOMATICALLY REPEATS THIS CYCLE UNTIL A RESISTIVITY PROFOLE FOR THE DESIRED DEPTH OF MATERIAL IS OBTAINED. A SHARP CHANGE WILL BE OBSERVED IN THE RECORDED PROFILE OF THE ELECTRICAL CHARACTERISTIC VERSUS THE AMOUNT OF MATERIAL REMOVED WHEN A PN JUCTION IS CROSSED.

公开(公告)号：CA1037615A

公开(公告)日：1978-08-29

申请号：CA233998

申请日：1975-08-19

Applicant: IBM

Inventor： DAVIDSON LEWIS A ,  DUFFY MICHAEL C ,  ERICKSON ALVARD J ,  GUNTHER-MOHR GERARD R ,  WILLIAMS RICHARD A

IPC: H05K1/02 ,  H01L21/60 ,  H01L23/02 ,  H01L23/04 ,  H01L23/36 ,  H01L23/538 ,  H05K1/14 ,  H05K7/20

Abstract: A FUNCTIONAL PACKAGE FOR COMPLEX ELECTRONIC SYSTEMS AND METHOD OF FABRICATION The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteristics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at low cost, more flexibility and suitable for complex electronics system.

公开(公告)号：FR2284190A1

公开(公告)日：1976-04-02

申请号：FR7521491

申请日：1975-07-04

Applicant: IBM

Inventor： DAVIDSON LEWIS A ,  DUFFY MICHAEL C ,  ERICKSON ALVARD J ,  GUNTHER-MOHR GERARD R ,  WILLIAMS RICHARD A

IPC: H01L21/60 ,  H01L23/02 ,  H01L23/04 ,  H01L23/36 ,  H05K1/02 ,  H01L23/538 ,  H05K1/14 ,  H01L23/34 ,  H01L21/96 ,  H01L23/32

Abstract: The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteristics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at a low cost, more flexibility and suitable for complex electronics system.

公开(公告)号：CA893385A

公开(公告)日：1972-02-15

申请号：CA893385D

Applicant: IBM

Inventor： DUFFY MICHAEL C ,  RISEMAN JACOB ,  WU BEVAN P F

公开(公告)号：DE2536316A1

公开(公告)日：1976-03-18

申请号：DE2536316

申请日：1975-08-14

Applicant: IBM

Inventor： DAVIDSON LEWIS A ,  DUFFY MICHAEL C ,  ERICKSON ALVARD J ,  GUNTHER-MOHR GERARD R ,  WILLIAMS RICHARD A

IPC: H05K1/02 ,  H01L21/60 ,  H01L23/02 ,  H01L23/04 ,  H01L23/36 ,  H01L23/538 ,  H05K1/14 ,  H05K3/36

Abstract: The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteristics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at a low cost, more flexibility and suitable for complex electronics system.