公开(公告)号：DE2933172A1

公开(公告)日：1980-03-13

申请号：DE2933172

申请日：1979-08-16

Applicant: IBM

Inventor： DAVIES JOHN EDWARD ,  GALLI GUIDO

IPC: C30B19/06 ,  C30B19/10 ,  H01F41/28 ,  H01L21/208 ,  B01J17/06

Abstract: A method of forming an improved liquid phase epitaxial film on a wafer. The resultant film has improved uniformity of magnetic properties, such as the collapse field (Ho), across the surface of the wafer as well as being substantially free of mesa defects on the surface. The method includes the step of growing the liquid phase epitaxial film while the wafer is in the horizontal plane. The wafer is removed from the melt while the wafer is tilted at an angle from the horizontal plane so that the melt may drain from the wafer. Then the wafer is positioned in a horizontal plane again and rotated to remove the remaining melt droplets from the edge of the wafer. In a preferred embodiment, a plurality of wafers are positioned in a wafer holding means so that the wafers are arranged in a stacked manner having substantially the same space between adjacent wafers. Wafers may also be stacked in pairs that are back-to-back while carrying out this method.

公开(公告)号：AU524571B2

公开(公告)日：1982-09-23

申请号：AU4871879

申请日：1979-07-06

Applicant: IBM

Inventor： DAVIES JOHN EDWARD ,  GALLI GUIDO

IPC: C30B19/06 ,  C30B19/10 ,  H01F41/28 ,  H01L21/208 ,  B01J17/06

Abstract: A method of forming an improved liquid phase epitaxial film on a wafer. The resultant film has improved uniformity of magnetic properties, such as the collapse field (Ho), across the surface of the wafer as well as being substantially free of mesa defects on the surface. The method includes the step of growing the liquid phase epitaxial film while the wafer is in the horizontal plane. The wafer is removed from the melt while the wafer is tilted at an angle from the horizontal plane so that the melt may drain from the wafer. Then the wafer is positioned in a horizontal plane again and rotated to remove the remaining melt droplets from the edge of the wafer. In a preferred embodiment, a plurality of wafers are positioned in a wafer holding means so that the wafers are arranged in a stacked manner having substantially the same space between adjacent wafers. Wafers may also be stacked in pairs that are back-to-back while carrying out this method.

公开(公告)号：AU4871879A

公开(公告)日：1980-03-06

申请号：AU4871879

申请日：1979-07-06

Applicant: IBM

Inventor： DAVIES JOHN EDWARD ,  GALLI GUIDO

IPC: C30B19/06 ,  C30B19/10 ,  H01F41/28 ,  H01L21/208 ,  B01J17/06

Abstract: A method of forming an improved liquid phase epitaxial film on a wafer. The resultant film has improved uniformity of magnetic properties, such as the collapse field (Ho), across the surface of the wafer as well as being substantially free of mesa defects on the surface. The method includes the step of growing the liquid phase epitaxial film while the wafer is in the horizontal plane. The wafer is removed from the melt while the wafer is tilted at an angle from the horizontal plane so that the melt may drain from the wafer. Then the wafer is positioned in a horizontal plane again and rotated to remove the remaining melt droplets from the edge of the wafer. In a preferred embodiment, a plurality of wafers are positioned in a wafer holding means so that the wafers are arranged in a stacked manner having substantially the same space between adjacent wafers. Wafers may also be stacked in pairs that are back-to-back while carrying out this method.