公开(公告)号：JPH08307028A

公开(公告)日：1996-11-22

申请号：JP5729796

申请日：1996-03-14

Applicant: IBM

Inventor： JIEIMUZU JIENSU HANSEN ,  JIYON MASHIYUU RAUFUAA ,  DEIBITSUDO JIYON RATSUSERU

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/44 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To eliminate a Cu plating required for conductors and all inner connections by forming at a thickness for providing specified insulation withstanding voltage directly on one surface of a metal carrier and providing openings for electric interconnections, thermal diffusion or mounting components on carrier means. SOLUTION: An insulation material 32, which is capable of optically forming images, is deposited on a carrier 31 made of a metal functioning as a ground or common potential as well as a heat sink and formed at a depth which is sufficient to provide insulation withstanding a voltage of 2500 V, a Cu foil 38 of required thickness is laid thereon, and wiring pattern of electric interconnecting vias 33, radiation vias and parts mounting openings 34 for mounting components 35 with a solder 36 is formed in the foil 37, thereby removing the Cu plating work required for conductors and all the inner connections.

公开(公告)号：JPH05188593A

公开(公告)日：1993-07-30

申请号：JP10341192

申请日：1992-04-23

Applicant: IBM

Inventor： NOOMAN OORUDORITSUCHI KAADO JI ,  RICHIYAADO AREN DEI ,  RAMUKURISHIYUNA GOOSARU ,  DONARUDO HAAMAN GURAATSUERU ,  DEIBITSUDO JIYON RATSUSERU

IPC: G03F7/004 ,  G03F7/028 ,  G03F7/038 ,  G03F7/075 ,  H05K3/28

Abstract: PURPOSE: To provide an improved cationic polymerizable epoxy-base coating material capable of photoimaging. CONSTITUTION: This improved compsn. contains an epoxy resin system consisting essentially of about 10-80wt.% polyol resin as a condensation product of epichlorohydrin and bisphenol A and about 20-90wt.% epoxidized octafunctional bisphenol A-formaldehyde novolak resin or further contg. about 35-50wt.% epoxidized glycidyl ether of tetrabromobisphenol A if flame resistance is required and contains a cationic photoinitiator capable of initiating the polymn. of the epoxy resin system at the time of exposure with chemical radiation by about 0.1-15 pts.wt. per 100 pts.wt. of the resins. The epoxy resin system has light absorption of