公开(公告)号：CA1124324A

公开(公告)日：1982-05-25

申请号：CA345148

申请日：1980-02-06

Applicant: IBM

Inventor： CAMMARANO ARMANDO S ,  DIGIACOMO GIULIO ,  DROFITZ STEPHEN S JR

IPC: G01R19/00 ,  G01R19/08 ,  G01R19/15 ,  G01R31/302 ,  H01L21/66

Abstract: A method for determining the paths of current flow in an irregularly shaped conductor. A metal is plated onto a substrate in the desired geometric pattern. The metal is then brought to within about 4 percent of its melting point and a current is put through it. After an amount of time that depends upon the temperature and current utilized, there will have been a mass migration in the metal resulting in a corrugated surface having ridges and valleys that are parallel to the current flow. The ridges and valleys may be observed optically or by scanning electron microscope. PO9-79-009

公开(公告)号：DE3171139D1

公开(公告)日：1985-08-01

申请号：DE3171139

申请日：1981-10-27

Applicant: IBM

Inventor： CAMMARANO ARMANDO SALVATORE ,  DIGIACOMO GIULIO

IPC: B23K1/20 ,  B23K1/00 ,  B23K35/00 ,  B23K35/14 ,  B23K35/30

公开(公告)号：DE3063235D1

公开(公告)日：1983-07-07

申请号：DE3063235

申请日：1980-02-21

Applicant: IBM

Inventor： CAMMARANO ARMANDO SALVATORE ,  DIGIACOMO GIULIO ,  DROFITZ JR STEPHEN STANLEY

IPC: G01R19/00 ,  G01R19/08 ,  G01R19/15 ,  G01R31/302 ,  H01L21/66 ,  G01R29/14 ,  G01K11/06

Abstract: The specification discloses a method for determining the paths of current flow in an irregularly shaped conductor. A metal is plated onto a substrate in the desired geometric pattern. The metal is then brought to within about 4 percent of its melting point and a current is put through it. After an amount of time that depends upon the temperature and current utilized, there will have been a mass migration in the metal resulting in a corrugated surface having ridges and valleys that are parallel to the current flow. The ridges and valleys may be observed optically or by scanning electron microscope.

公开(公告)号：MY120991A

公开(公告)日：2005-12-30

申请号：MYPI9802781

申请日：1998-06-19

Applicant: IBM

Inventor： DIGIACOMO GIULIO

IPC: H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L29/40 ,  H05K3/34

Abstract: A SOLDER COLUMN STRUCTURE (19) PARTICULARLY USEFUL FOR JOINING ELECTRONIC COMPONENTS BY C-4 INTERCONNECTION (24) IS PROVIDED COMPRISING A SOLDER COLUMN (17, 22) ATTACHED AT ONE END TO ONE OF THE SUBSTRATES (11) BEING JOINED AND HAVING A LAYER OF INDIUM (18) AT THE OTHER END. DURING REFLOW, TO JOIN THE OTHER SUBSTRATE (20), THE INDIUM MELTS WITH PART OF THE SOLDER COLUMN FORMING A PB-SN-IN TERNARY ALLOW JOINT HAVING ENHANCED FATIGUE RESISTANCE. A METHOD FOR USING THE SOLDER COLUMN TO MAKE ELECTRONIC COMPONENT ASSEMBLIES (25) AND ELECTRONIC COMPONENT ASSEMBLIES MADE USING THE METHOD AND SOLDER COLUMN ARE ALSO PROVIDED.(FIG: 1E)

公开(公告)号：SG74641A1

公开(公告)日：2000-08-22

申请号：SG1998001810

申请日：1998-07-16

Applicant: IBM

Inventor： DIGIACOMO GIULIO

IPC: H01L23/485 ,  H05K3/34 ,  H01L21/60

Abstract: A solder column structure particularly useful for joining electronic components by C-4 interconnection is provided comprising a solder column attached at one end to one of the substrates being joined and having a layer of indium at the other end. During reflow, to join the other substrate, the indium melts with part of the solder column forming a Pb-Sn-In ternary alloy joint having enhanced fatigue resistance. A method for using the solder column to make electronic component assemblies and electronic component assemblies made using the method and solder column are also provided.

公开(公告)号：CA1175297A

公开(公告)日：1984-10-02

申请号：CA389006

申请日：1981-10-29

Applicant: IBM

Inventor： CAMMARANO ARMANDO S ,  DIGIACOMO GIULIO

IPC: B23K1/20 ,  B23K1/00 ,  B23K35/00 ,  B23K35/14 ,  B23K35/30 ,  B23K3/00

Abstract: PO9-80-022 PROCESS FOR BRAZING A method of brazing two surfaces together with a Au/Sn brazing solder. The method includes the additional step of providing a film of Cu, for example on one of the surfaces, in addition to the Au/Sn brazing solder.