公开(公告)号：SG97196A1

公开(公告)日：2003-07-18

申请号：SG200106064

申请日：2001-09-28

Applicant: IBM

Inventor： DONALD F CANAPERI ,  JACK OON CHU ,  GUY COHEN ,  LIJUAN HUANG ,  JOHN ALBRECHT OTT ,  MICHAEL F LOFARO

IPC: H01L21/304 ,  B24B37/34 ,  B24B49/00 ,  H01L21/02 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/762 ,  H01L21/84

Abstract: A method and apparatus is described incorporating a semiconductor substrate, a CMP tool, a brush cleaning tool, and a chemical wafer cleaning tool. The CMP is performed with a down force of 1 psi, a backside air pressure of 0.5 psi, a platen speed of 50 rpm, a crarrier speed of 30 rpm and a slurry flow rate of 140 milliliters per minute.