公开(公告)号：JPH06209153A

公开(公告)日：1994-07-26

申请号：JP26705593

申请日：1993-10-26

Applicant: IBM

Inventor： RICHIYAADO AREN DEI ,  DONARUDO HERUMAN GURATSUTSUERU ,  JIYON RICHIYAADO MERUTSU ,  JIYOERU RARII ROSU ,  DEEBUITSUDO JIYON RATSUSERU ,  ROOGAN ROIDO SHINPUSON

IPC: C08G59/18 ,  C08L63/00 ,  H05K1/03 ,  H05K3/28

Abstract: PURPOSE: To improve a coating resolution with an epoxy resin that is subjected to cation polymerization such as solder mask, dielectric, and etch resist as a main constituent. CONSTITUTION: A coating with an epoxy resin that is subjected to cation polymerization as a main constituent is combined with a normal epoxy glass substrate that is cured by a curing agent that does not generating a base-reaction product. A coating that can form a light image is preferable. A coating material includes polyol epoxy resin with approximately 10-90 wt.% or preferably approximately 28-57 wt.% and bromide epoxy resin with approximately 10-90 wt.%, preferably approximately 43-72 wt.%. Polyepoxy resin or epoxy cresol novolak resin may be added by arbitrary selection. The polyepoxy resin can be added by an effective amount or less than 90% of resin system and epoxy cresol novolak resin can be added up to approximately 80%, thus obtaining a coating composition with a high resolution that can be used for a soldering mask.