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    1.
    发明专利

    公开(公告)号:JPH06209153A

    公开(公告)日:1994-07-26

    申请号:JP26705593

    申请日:1993-10-26

    Applicant: IBM

    Abstract: PURPOSE: To improve a coating resolution with an epoxy resin that is subjected to cation polymerization such as solder mask, dielectric, and etch resist as a main constituent. CONSTITUTION: A coating with an epoxy resin that is subjected to cation polymerization as a main constituent is combined with a normal epoxy glass substrate that is cured by a curing agent that does not generating a base-reaction product. A coating that can form a light image is preferable. A coating material includes polyol epoxy resin with approximately 10-90 wt.% or preferably approximately 28-57 wt.% and bromide epoxy resin with approximately 10-90 wt.%, preferably approximately 43-72 wt.%. Polyepoxy resin or epoxy cresol novolak resin may be added by arbitrary selection. The polyepoxy resin can be added by an effective amount or less than 90% of resin system and epoxy cresol novolak resin can be added up to approximately 80%, thus obtaining a coating composition with a high resolution that can be used for a soldering mask.

    DRY-FILM TYPE PHOTORESIST COMPOSITION WHICH CAN UNDERGO WATER PROCESSING

    公开(公告)号:JPH04230758A

    公开(公告)日:1992-08-19

    申请号:JP8115291

    申请日:1991-03-22

    Applicant: IBM

    Abstract: PURPOSE: To enable aqueous processing in a dry film type by consisting of a polymer binder produced from tert-butyl methacrylate/methyl methacrylate/ acrylic acid/ethyl acrylate and an initiator. CONSTITUTION: This photoresist composition consists of the film forming polymer binder and the initiator generating an acid by the exposure with radiation. The polymer chain of the polymer binder is controlled to be composed of next polymerizing units: (1) a 1st monomer giving an acid sensitive side chain group to the polymer main chain, (2) a 2nd monomer selected from a group composed of an alkyl methacrylate, an acrylate and the combination and (3) a 3rd monomer selected from a group composed of an acrylate based carboxylic acid and an methacylate based carboxylic acid. As a result, the photoresist composition is capable of forming a rigid film, executing deprotective chemical change by an acid catalyst, forming an image with high resolution and being developed with sodium carbonate/water.

    PHOTORESIST COMPOSITION IN LIQUID APPLICATION TYPE WHICH CAN UNDERGO WATER PROCESSING

    公开(公告)号:JPH04226461A

    公开(公告)日:1992-08-17

    申请号:JP8115391

    申请日:1991-03-22

    Applicant: IBM

    Abstract: PURPOSE: To obtain the photoresist having high sensitivity and high resolution by using a (tertiary-butyl methacrylate)/(methyl methacrylate)/(methacrylic acid) polymer binder and an initiator that generates an acid when it is exposed to radiation, as components of the composition. CONSTITUTION: In this composition, the film-forming polymer binder used is an acrylic polymer that has acid-convertible side chains and is capable of forming a photoresist by allowing it to react with a selected luminescent agent through chemical-sensitizing reaction. Polymer chains of the polymer binder consist of a first monomer that provides a polymer main chain with the acid- sensitive side chain groups, a second monomer that is selected from alkyl methacrylates, alkyl acrylates and combinations of them, and a third monomer that is selected from acryl-based carboxylic acids and methacryl-based carboxylic acids.

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