公开(公告)号：CA2350747C

公开(公告)日：2005-08-16

申请号：CA2350747

申请日：2001-06-15

Applicant: IBM CANADA

Inventor： BOYAUD MARIE-FRANCE ,  PAQUET MARIE-CLAUDE ,  DUFORT CATHERINE ,  TETREAULT REAL

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/34

Abstract: Improvements in providing integrated circuit packages using transfer molding by encapsulating and underfilling integrated circuit chips attached to substrates are described. According to the invention there is provided method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly consisting of an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portio n wherein the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means applies a clamping force to the first and the second portio ns of the mold to clamp the substrate between the first and second portions with the integrate d circuit chip located in the first cavity. Vent means exhausts air from the first cavity. Means for injecting encapsulant into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel to the first cavity, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the seco nd cavity to thereby underfill and encapsulate the integrated circuit assembly.

公开(公告)号：DE112020003969T5

公开(公告)日：2022-05-05

申请号：DE112020003969

申请日：2020-09-16

Applicant: IBM

Inventor： DRUMMOND KEVIN ,  LOMBARDI THOMAS ,  OSTRANDER STEVE ,  ALLARD STEPHANIE ,  DUFORT CATHERINE

IPC: H05K3/30 ,  H01L23/32 ,  H05K3/34

Abstract: Eine Struktur (101) mit einer gesteuerten kapillaren Bedeckung wird bereitgestellt und weist ein Substrat (110), das einen oder mehrere erste Kontakte (112) aufweist, eine Komponente (130) sowie ein Haftmittel (140) auf. Die Komponente (130) weist einen oder mehrere zweite Kontakte (132) sowie eine Rippe (133) auf, die in einem Abstand von jedem von dem einen oder den mehreren zweiten Kontakten (132) angeordnet ist. Die Komponente (130) ist derart angeordnet, dass der eine oder die mehreren zweiten Kontakte (132) mit dem einen oder den mehreren ersten Kontakten (112) in Verbindung steht/stehen und dass entsprechende Oberflächen des Substrats (110) und die Rippe (133) einander auf einer gesteuerten Zwischenraumhöhe gegenüberliegen, so dass ein Füllraum (150) definiert wird. Das Haftmittel (140) wird an einem einzelnen Punkt (141) verteilt, so dass das Haftmittel (140) durch die Kapillarwirkung so gezogen wird, dass der Füllraum (150) gefüllt wird.

公开(公告)号：CA2350747A1

公开(公告)日：2002-12-15

申请号：CA2350747

申请日：2001-06-15

Applicant: IBM CANADA

Inventor： PAQUET MARIE-CLAUDE ,  TETREAULT REAL ,  BOYAUD MARIE-FRANCE ,  DUFORT CATHERINE

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/34

Abstract: Improvements in providing integrated circuit packages using transfer molding by encapsulating and underfilling integrated circuit chips attached to substrates are described. According to the invention there is provided method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly consisting of an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portio n wherein the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means applies a clamping force to the first and the second portio ns of the mold to clamp the substrate between the first and second portions with the integrate d circuit chip located in the first cavity. Vent means exhausts air from the first cavity. Means for injecting encapsulant into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel to the first cavity, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the seco nd cavity to thereby underfill and encapsulate the integrated circuit assembly.