公开(公告)号：CA2180807A1

公开(公告)日：1998-01-10

申请号：CA2180807

申请日：1996-07-09

Applicant: IBM CANADA

Inventor： BOUTIN LYNDA ,  LETOURNEAU MARTIAL A ,  TETREAULT REAL

IPC: B29C45/26 ,  B29C45/02 ,  B29C70/70 ,  B29L31/34 ,  H01L21/56 ,  H01L23/02 ,  H01L23/12 ,  H01L23/24 ,  H01L23/29 ,  H01L23/50

Abstract: A method and resulting integrated circuit package is disclosed for encapsula tingintegrated circuit chips using transfer molding tech niques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit card and the contact s are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carr ier.Liquid plastic is forced into the cavity via a runne r in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components .

公开(公告)号：CA2350747A1

公开(公告)日：2002-12-15

申请号：CA2350747

申请日：2001-06-15

Applicant: IBM CANADA

Inventor： PAQUET MARIE-CLAUDE ,  TETREAULT REAL ,  BOYAUD MARIE-FRANCE ,  DUFORT CATHERINE

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/34

Abstract: Improvements in providing integrated circuit packages using transfer molding by encapsulating and underfilling integrated circuit chips attached to substrates are described. According to the invention there is provided method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly consisting of an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portio n wherein the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means applies a clamping force to the first and the second portio ns of the mold to clamp the substrate between the first and second portions with the integrate d circuit chip located in the first cavity. Vent means exhausts air from the first cavity. Means for injecting encapsulant into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel to the first cavity, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the seco nd cavity to thereby underfill and encapsulate the integrated circuit assembly.

公开(公告)号：CA2350747C

公开(公告)日：2005-08-16

申请号：CA2350747

申请日：2001-06-15

Applicant: IBM CANADA

Inventor： BOYAUD MARIE-FRANCE ,  PAQUET MARIE-CLAUDE ,  DUFORT CATHERINE ,  TETREAULT REAL

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/34

Abstract: Improvements in providing integrated circuit packages using transfer molding by encapsulating and underfilling integrated circuit chips attached to substrates are described. According to the invention there is provided method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly consisting of an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portio n wherein the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means applies a clamping force to the first and the second portio ns of the mold to clamp the substrate between the first and second portions with the integrate d circuit chip located in the first cavity. Vent means exhausts air from the first cavity. Means for injecting encapsulant into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel to the first cavity, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the seco nd cavity to thereby underfill and encapsulate the integrated circuit assembly.