公开(公告)号：JP2000101221A

公开(公告)日：2000-04-07

申请号：JP13474499

申请日：1999-05-14

Applicant: IBM

Inventor： RABI F SARAFU ,  JUDITH MARIE RORUDAN ,  MICHAEL ANTHONY GAINS ,  RICHARD BENTON BOSS ,  STEPHEN PAUL OSTLUNDER ,  EMMANUEL I COOPER ,  CARLOS J SANBUSECCHI

IPC: H05K3/40 ,  C09J9/02 ,  H01B1/22 ,  H01L21/60 ,  H05K1/09 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide a conductive paste which can be melted again and does not contain a flux material corrosive to electric products by allowing a composite material to contain a conductive metallic powder at a specific ratio to the total volume thereof. SOLUTION: The dissolving temperature of a thermoplastic polymer applicable to a conductive paste 12 is preferably at least about 200 deg.C. The melting point of a second elemental metallic powder of the conductive paste 12 is preferably at least about 200 deg.C. A third element of the conductive paste 12 is a polar organic solvent having a boiling point of about 130-300 deg.C. A conductive composite material comprises a metal containing no oxide, which is preferably at least 30 vol.% to its total volume. The conductive composite material is formed by heating the conductive paste. To form conductive mutual connection, a paste is injected and a pressure is applied at a higher temperature than the glass transition temperature of the thermoplastic polymer.