公开(公告)号：US3561110A

公开(公告)日：1971-02-09

申请号：US3561110D

申请日：1967-08-31

Applicant: IBM

Inventor： FEULNER RICHARD A ,  MILKOVICH STEPHEN A ,  MILLER LEWIS F

IPC: H01R12/51 ,  H05K1/03 ,  H05K1/16 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46 ,  B41M3/08

CPC classification number: H05K3/102 ,  H01R12/523 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4641 ,  H05K2201/0116 ,  H05K2201/0305 ,  H05K2201/096 ,  H05K2203/1131 ,  H05K2203/128 ,  Y10T29/435 ,  Y10T29/4902 ,  Y10T29/49099 ,  Y10T29/49993

Abstract: ELECTRICAL AND/OR THERMAL CONNECTION BETWEEN CONDUCTIVE LAYERS IN CERAMIC OR OTHER HIGH TEMPERATURE SUBSTRATES, AND INTERNAL OR ATTACHED METALLURGICAL STRUCTURES, IS OBTAINED BY FILLING VIA OR TRANSVERSE HOLES WITH DRY METALLIC PARTICLES AND SINTERING.