1.
    发明专利
    未知

    公开(公告)号:DE3883584T2

    公开(公告)日:1994-04-21

    申请号:DE3883584

    申请日:1988-03-29

    Applicant: IBM

    Abstract: Method and apparatus utilizing the known technique of extrusion to form a plurality of very small pins, with diameters of 0,5 mm or smaller, in a substrate (14) of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die (12) is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die (13) with matching orifices (19, 20) that is fixed on an extrusion press (46). A head die (11) presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.

    2.
    发明专利
    未知

    公开(公告)号:DE3883584D1

    公开(公告)日:1993-10-07

    申请号:DE3883584

    申请日:1988-03-29

    Applicant: IBM

    Abstract: Method and apparatus utilizing the known technique of extrusion to form a plurality of very small pins, with diameters of 0,5 mm or smaller, in a substrate (14) of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die (12) is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die (13) with matching orifices (19, 20) that is fixed on an extrusion press (46). A head die (11) presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.

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